TY - GEN
T1 - Wireless impedance measurements for monitoring peripheral vascular disease
AU - Celinskis, Dmitrijs
AU - Towe, Bruce C.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/2
Y1 - 2014/11/2
N2 - Wireless microdevices powered by ultrasound energy have been fabricated to measure and telemeter tissue impedance spectrums for applications in peripheral vascular disease monitoring. The system is characterized by simplicity of the implant consisting of only two electrical components. Ex vivo testing shows the potential for constructing tissue impedance spectrum plots over the range from 10 Hz to 10 kHz by a device less than 1 mm in diameter and 1 cm long. The neurostimulator microdevice was powered by continuous waveform 650 kHz ultrasound with a swept-frequency amplitude modulation. The system was operated at safe ultrasound power levels on the order of 10-100 mW/cm2. The device proved to be sensitive and able to measure tissue impedances over a broad range. Volume conducted signals carrying impedance information from the microdevice were remotely detected by surface biopotential electrodes.
AB - Wireless microdevices powered by ultrasound energy have been fabricated to measure and telemeter tissue impedance spectrums for applications in peripheral vascular disease monitoring. The system is characterized by simplicity of the implant consisting of only two electrical components. Ex vivo testing shows the potential for constructing tissue impedance spectrum plots over the range from 10 Hz to 10 kHz by a device less than 1 mm in diameter and 1 cm long. The neurostimulator microdevice was powered by continuous waveform 650 kHz ultrasound with a swept-frequency amplitude modulation. The system was operated at safe ultrasound power levels on the order of 10-100 mW/cm2. The device proved to be sensitive and able to measure tissue impedances over a broad range. Volume conducted signals carrying impedance information from the microdevice were remotely detected by surface biopotential electrodes.
UR - http://www.scopus.com/inward/record.url?scp=84929501042&partnerID=8YFLogxK
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U2 - 10.1109/EMBC.2014.6945223
DO - 10.1109/EMBC.2014.6945223
M3 - Conference contribution
AN - SCOPUS:84929501042
T3 - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
SP - 6937
EP - 6940
BT - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
Y2 - 26 August 2014 through 30 August 2014
ER -