Wafer-level vacuum package with vertical feedthroughs

Junseok Chae, Joseph M. Giachino, Khalil Najafi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Scopus citations

Abstract

This paper reports a MEMS vacuum package with vertical feedthroughs formed in a glass substrate all at the wafer level. This approach satisfies requirements for MEMS vacuum packages, including small size, vacuum/hermetic capability, sealed and low parasitic feedthroughs, wafer level processing, compatibility with most MEMS processes, and low cost. It also enables flip-chip solder attachment to a PC board. The package has an integrated micro-Pirani gauge on a glass substrate for in-situ monitoring, silicon cap, and vertical feedthroughs through the glass. The integrated Pirani gauge has 0.1Torr resolution at 0.1Torr and 0.2Torr resolution at 100Torr. Using the Pirani gauge, we have achieved ∼11Torr base pressure inside the vacuum package without a getter. Another package sealed at ∼80Torr has maintained its pressure for more than 2 months.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages548-551
Number of pages4
StatePublished - 2005
Externally publishedYes
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: Jan 30 2005Feb 3 2005

Other

Other18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period1/30/052/3/05

Keywords

  • Packaging
  • Pirani gauge
  • Vacuum package
  • Vertical feedthroughs

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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  • Cite this

    Chae, J., Giachino, J. M., & Najafi, K. (2005). Wafer-level vacuum package with vertical feedthroughs. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 548-551). [TPb31]