Wafer Bond Strength Evaluation Apparatus

Terry Alford (Inventor)

Research output: Patent

Abstract

ASU researchers have developed an improved apparatus for measuring the bond strength of wafers using the Maszara crack propogation technique. The device allows for greater accuracy and reproducability in measuring bond strength, facilitating a better understanding of the behavior of bonded wafers.
Original languageEnglish (US)
StatePublished - Jan 17 2003

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