Virtual metrology modeling for plasma etch operations

Dekong Zeng, Costas J. Spanos, Yajing Tan, Tzu Yu Wang, Chun Hsien Lin, Henry Lo, Jean Wang, C. H. Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The objective of this paper is to present the utilization of information produced during plasma etching for the prediction of etch bias. A plasma etching process typically relies on the concentration of chemical species in reaction chambers over time, where each concentration depends on chamber pressure, gas flow rate, power level and other chamber and wafer properties. Plasma properties, as well as equipment factors are nonlinear and vary over time. In this work, we will use various statistical techniques to address challenges due to the nature of plasma data: high dimensionality, collinearity, overall non-linearity of system, variation of data structure due to equipment condition changing, etc.

Original languageEnglish (US)
Title of host publication2008 International Symposium on Semiconductor Manufacturing, ISSM 2008
Pages269-272
Number of pages4
StatePublished - Dec 1 2008
Externally publishedYes
Event2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008 - Tokyo, Japan
Duration: Oct 27 2008Oct 29 2008

Publication series

NameIEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN (Print)1523-553X

Other

Other2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008
CountryJapan
CityTokyo
Period10/27/0810/29/08

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Zeng, D., Spanos, C. J., Tan, Y., Wang, T. Y., Lin, C. H., Lo, H., Wang, J., & Yu, C. H. (2008). Virtual metrology modeling for plasma etch operations. In 2008 International Symposium on Semiconductor Manufacturing, ISSM 2008 (pp. 269-272). [5714918] (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings).