Abstract
This work introduces and explores vapor phase metal-assisted chemical etching (VP-MaCE) of silicon as a method to bypass some of the challenges found in traditional liquid phase metal-assisted chemical etching (LP-MaCE). Average etch rates for Ag, Au, and Pd/Au catalysts are established at 31, 70, and 96 nm/min respectively, and the relationship between etch rate and substrate temperature is examined experimentally. Just as with LP-MaCE, 3D catalyst motion is maintained and three-dimensional structures are fabricated with nanoparticle- and lithography-patterned catalysts. VP-MaCE produces less microporous silicon compared with LP-MaCE and the diffusion/reduction distance of Ag+ ions is significantly reduced. This process sacrifices etch rate for increased etch uniformity and lower stiction for applications in micro-electromechanical systems (MEMS) processing. To overcome non-uniformity and microporous silicon generation seen in traditional liquid-phase metal-assisted chemical etching, vapor-phase metal-assisted chemical etching (VP-MaCE) is used instead. The etch rate is evaluated as a function of catalyst, time, and substrate temperature.
Original language | English (US) |
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Pages (from-to) | 3827-3833 |
Number of pages | 7 |
Journal | Advanced Functional Materials |
Volume | 24 |
Issue number | 24 |
DOIs | |
State | Published - Jun 25 2014 |
Keywords
- chemical etching
- electroless
- metal-assisted chemical etching
- nanofabrication
- silicon
- vapor phase
ASJC Scopus subject areas
- Chemistry(all)
- Materials Science(all)
- Condensed Matter Physics