Vacancy diffusion along twist grain boundaries in copper

Miki Nomura, Sing Yun Lee, James B. Adams

Research output: Contribution to journalArticlepeer-review

28 Scopus citations


Vacancy diffusion along two different high-angle twist grain boundaries (Σ5 and Σ13) was studied using the Embedded Atom Method (EAM). Vacancy formation energies in all the possible sites were calculated and found to be directly related to the degree of coincidence with the neighboring crystal planes. Optimal migration paths and migration energies were determined and found to be very low. The activation energies for self-diffusion at the boundaries were found to be less than half of the bulk value.

Original languageEnglish (US)
Pages (from-to)1-4
Number of pages4
JournalJournal of Materials Research
Issue number1
StatePublished - Jan 1991
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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