Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities

Allan D. Chasey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Building Information Modeling (BIM) is an approach gaining traction in the architect, engineer and construction (AEC) industry. BIM combines the ability to construct a virtual model with all aspects of a facility, from design to operations and maintenance. BIM directly relates to a project team's ability for Visualization, Understanding, Communication, and Collaboration. During the course of a project, information gradually increases in scope, depth, and relationship to the project. Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. This paper will focus on the benefits of BIM and how this process can be used to reduce risk and improve project delivery for new complex advanced technology facilities such as semiconductor manufacturing facilities. Risk reduction and a value-added construction process comes through improved understanding, coordination, and material use in the management of the project as well as fewer conflicts, waste, and cost. The concept of Intelligent Tool Models and Intelligent Fab Models are discussed to demonstrate the improved life-cycle facilitation of a semiconductor fabrication facility.

Original languageEnglish (US)
Title of host publicationISEC 2013 - 7th International Structural Engineering and Construction Conference
Subtitle of host publicationNew Developments in Structural Engineering and Construction
EditorsSiamak Yazdani, Amarjit Singh
PublisherResearch Publishing Services
Pages1155-1159
Number of pages5
ISBN (Electronic)9810753551, 9789810753559
DOIs
StatePublished - Jan 1 2013
Event7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction, ISEC 2013 - Honolulu, United States
Duration: Jun 18 2013Jun 23 2013

Publication series

NameISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction

Other

Other7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction, ISEC 2013
CountryUnited States
CityHonolulu
Period6/18/136/23/13

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Keywords

  • Benefits of BIM
  • Building Information Modeling
  • Intelligent facilities
  • Project delivery
  • Risk
  • Semiconductor facility construction

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Building and Construction

Cite this

Chasey, A. D. (2013). Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. In S. Yazdani, & A. Singh (Eds.), ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction (pp. 1155-1159). (ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction). Research Publishing Services. https://doi.org/10.3850/978-981-07-5354-2-C-21-181