Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities

Allan D. Chasey

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Building Information Modeling (BIM) is an approach gaining traction in the architect, engineer and construction (AEC) industry. BIM combines the ability to construct a virtual model with all aspects of a facility, from design to operations and maintenance. BIM directly relates to a project team's ability for Visualization, Understanding, Communication, and Collaboration. During the course of a project, information gradually increases in scope, depth, and relationship to the project. Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. This paper will focus on the benefits of BIM and how this process can be used to reduce risk and improve project delivery for new complex advanced technology facilities such as semiconductor manufacturing facilities. Risk reduction and a value-added construction process comes through improved understanding, coordination, and material use in the management of the project as well as fewer conflicts, waste, and cost. The concept of Intelligent Tool Models and Intelligent Fab Models are discussed to demonstrate the improved life-cycle facilitation of a semiconductor fabrication facility.

    Original languageEnglish (US)
    Title of host publicationISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction
    PublisherResearch Publishing Services
    Pages1155-1159
    Number of pages5
    ISBN (Print)9810753551, 9789810753559
    DOIs
    StatePublished - 2013
    Event7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction, ISEC 2013 - Honolulu, United States
    Duration: Jun 18 2013Jun 23 2013

    Other

    Other7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction, ISEC 2013
    CountryUnited States
    CityHonolulu
    Period6/18/136/23/13

    Fingerprint

    Semiconductor materials
    Construction industry
    Life cycle
    Visualization
    Engineers
    Fabrication
    Communication
    Costs
    Industry

    Keywords

    • Benefits of BIM
    • Building Information Modeling
    • Intelligent facilities
    • Project delivery
    • Risk
    • Semiconductor facility construction

    ASJC Scopus subject areas

    • Civil and Structural Engineering
    • Building and Construction

    Cite this

    Chasey, A. D. (2013). Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. In ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction (pp. 1155-1159). Research Publishing Services. https://doi.org/10.3850/978-981-07-5354-2-C-21-181

    Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. / Chasey, Allan D.

    ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction. Research Publishing Services, 2013. p. 1155-1159.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Chasey, AD 2013, Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. in ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction. Research Publishing Services, pp. 1155-1159, 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction, ISEC 2013, Honolulu, United States, 6/18/13. https://doi.org/10.3850/978-981-07-5354-2-C-21-181
    Chasey AD. Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. In ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction. Research Publishing Services. 2013. p. 1155-1159 https://doi.org/10.3850/978-981-07-5354-2-C-21-181
    Chasey, Allan D. / Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities. ISEC 2013 - 7th International Structural Engineering and Construction Conference: New Developments in Structural Engineering and Construction. Research Publishing Services, 2013. pp. 1155-1159
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