ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.
|Original language||English (US)|
|State||Published - Jun 25 2003|