Use of Ag-Al Alloy Films to Improve the Thermal Stability for Ag Metallization

Terry Alford (Inventor)

Research output: Patent

Abstract

ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.
Original languageEnglish (US)
StatePublished - Jun 25 2003

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thermal stability
inventions
agglomeration
semiconductor devices
electronics
silver
high speed
polymers
thin films

Cite this

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abstract = "ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.",
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