Unified formulation for multiple vias with or without circular pads in high speed interconnects

Zhonghai Guo, George Pan, Helen K. Pan

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Fingerprint

Dive into the research topics of 'Unified formulation for multiple vias with or without circular pads in high speed interconnects'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds