Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model

Ying Ju Yu, Carole-Jean Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Modern high-performance electronics are embedded in smartphones, self-driving automobiles, and augmented reality wearable. These computing platforms are high performance and multifunctional. One of the major performance limiting factors in these platforms is the poorly designed thermal solution that is triggered to prevent overheating at the processor transistor junction and at the platform surface. Even though the dynamic voltage and frequency scaling (DVFS) feature widely available in modern processors can be used as a control knob in processor temperature management, its associated performance cost is tremendous and the response time for temperature control is significant.

Original languageEnglish (US)
Title of host publicationProceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages122-123
Number of pages2
Volume2017-January
ISBN (Electronic)9781538612323
DOIs
StatePublished - Dec 5 2017
Event2017 IEEE International Symposium on Workload Characterization, IISWC 2017 - Seattle, United States
Duration: Oct 1 2017Oct 3 2017

Other

Other2017 IEEE International Symposium on Workload Characterization, IISWC 2017
CountryUnited States
CitySeattle
Period10/1/1710/3/17

Fingerprint

Knobs
Augmented reality
Smartphones
Temperature control
Mobile devices
Automobiles
Transistors
Electronic equipment
Costs
Temperature
Voltage scaling
Dynamic frequency scaling
Hot Temperature
High performance
Scaling
Factors
Response time
Automobile

ASJC Scopus subject areas

  • Hardware and Architecture
  • Information Systems and Management

Cite this

Yu, Y. J., & Wu, C-J. (2017). Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model. In Proceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017 (Vol. 2017-January, pp. 122-123). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IISWC.2017.8167768

Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model. / Yu, Ying Ju; Wu, Carole-Jean.

Proceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. p. 122-123.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yu, YJ & Wu, C-J 2017, Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model. in Proceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017. vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 122-123, 2017 IEEE International Symposium on Workload Characterization, IISWC 2017, Seattle, United States, 10/1/17. https://doi.org/10.1109/IISWC.2017.8167768
Yu YJ, Wu C-J. Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model. In Proceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017. Vol. 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. p. 122-123 https://doi.org/10.1109/IISWC.2017.8167768
Yu, Ying Ju ; Wu, Carole-Jean. / Understanding the thermal challenges of high-performance mobile devices with a detailed platform temperature model. Proceedings of the 2017 IEEE International Symposium on Workload Characterization, IISWC 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. pp. 122-123
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