Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination

Javaid Ikram, Guoyi Li, Rajesh K. Neerukatti, Aditi Chattopadhyay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.

Original languageEnglish (US)
Title of host publicationStructural Health Monitoring 2017
Subtitle of host publicationReal-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017
PublisherDEStech Publications
Pages2320-2326
Number of pages7
Volume2
ISBN (Electronic)9781605953304
StatePublished - 2017
Event11th International Workshop on Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance, IWSHM 2017 - Stanford, United States
Duration: Sep 12 2017Sep 14 2017

Other

Other11th International Workshop on Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance, IWSHM 2017
CountryUnited States
CityStanford
Period9/12/179/14/17

Fingerprint

Guided electromagnetic wave propagation
Ultrasonic waves
Delamination
Integrated circuits
Inspection
Transducers
Adhesives
Copper
Piezoelectric transducers
Damage detection
Quality assurance
Wave propagation
Signal processing
Moisture
Actuators
Decomposition
Defects
Ultrasonic Waves
Sensors

ASJC Scopus subject areas

  • Health Information Management
  • Computer Science Applications

Cite this

Ikram, J., Li, G., Neerukatti, R. K., & Chattopadhyay, A. (2017). Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination. In Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017 (Vol. 2, pp. 2320-2326). DEStech Publications.

Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination. / Ikram, Javaid; Li, Guoyi; Neerukatti, Rajesh K.; Chattopadhyay, Aditi.

Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017. Vol. 2 DEStech Publications, 2017. p. 2320-2326.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ikram, J, Li, G, Neerukatti, RK & Chattopadhyay, A 2017, Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination. in Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017. vol. 2, DEStech Publications, pp. 2320-2326, 11th International Workshop on Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance, IWSHM 2017, Stanford, United States, 9/12/17.
Ikram J, Li G, Neerukatti RK, Chattopadhyay A. Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination. In Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017. Vol. 2. DEStech Publications. 2017. p. 2320-2326
Ikram, Javaid ; Li, Guoyi ; Neerukatti, Rajesh K. ; Chattopadhyay, Aditi. / Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination. Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017. Vol. 2 DEStech Publications, 2017. pp. 2320-2326
@inproceedings{4725c5e9b3e54ca3a3ca83092de15a43,
title = "Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination",
abstract = "Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.",
author = "Javaid Ikram and Guoyi Li and Neerukatti, {Rajesh K.} and Aditi Chattopadhyay",
year = "2017",
language = "English (US)",
volume = "2",
pages = "2320--2326",
booktitle = "Structural Health Monitoring 2017",
publisher = "DEStech Publications",

}

TY - GEN

T1 - Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination

AU - Ikram, Javaid

AU - Li, Guoyi

AU - Neerukatti, Rajesh K.

AU - Chattopadhyay, Aditi

PY - 2017

Y1 - 2017

N2 - Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.

AB - Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.

UR - http://www.scopus.com/inward/record.url?scp=85032373940&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85032373940&partnerID=8YFLogxK

M3 - Conference contribution

VL - 2

SP - 2320

EP - 2326

BT - Structural Health Monitoring 2017

PB - DEStech Publications

ER -