TY - GEN
T1 - Tuning Wireless Intra-Chip Channels with Programmable Metasurfaces
AU - Imani, Mohammadreza F.
AU - Abadal, Sergi
AU - Hougne, Philipp Del
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/9/20
Y1 - 2021/9/20
N2 - Communication on multi-core chips is a severe bottleneck for computational performance. A potential solution, wireless radiofrequency links between far apart cores, suffers from strong multipath effects within the chip package that cause inter-symbol interference. We propose to empower the on-chip propagation environment with in situ programmability by equipping it with a programmable metasurface. By locally tuning the boundary conditions of the metallic enclosure that the chip package constitutes, the programmable metasurface allows us to tailor the on-chip channel impulse response. Our numerical studies suggest that this approach may overcome the caveat of current wireless interconnects.
AB - Communication on multi-core chips is a severe bottleneck for computational performance. A potential solution, wireless radiofrequency links between far apart cores, suffers from strong multipath effects within the chip package that cause inter-symbol interference. We propose to empower the on-chip propagation environment with in situ programmability by equipping it with a programmable metasurface. By locally tuning the boundary conditions of the metallic enclosure that the chip package constitutes, the programmable metasurface allows us to tailor the on-chip channel impulse response. Our numerical studies suggest that this approach may overcome the caveat of current wireless interconnects.
UR - http://www.scopus.com/inward/record.url?scp=85118932485&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85118932485&partnerID=8YFLogxK
U2 - 10.1109/Metamaterials52332.2021.9577148
DO - 10.1109/Metamaterials52332.2021.9577148
M3 - Conference contribution
AN - SCOPUS:85118932485
T3 - 2021 15th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2021
SP - 164
EP - 166
BT - 2021 15th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International Congress on Artificial Materials for Novel Wave Phenomena, Metamaterials 2021
Y2 - 20 September 2021 through 25 September 2021
ER -