TY - GEN
T1 - TRUFL
T2 - 2019 IEEE International Conference on Communications, ICC 2019
AU - Chowdhary, Ankur
AU - Huang, Dijiang
AU - Alshamrani, Adel
AU - Kang, Myong
AU - Kim, Anya
AU - Velazquez, Alexander
N1 - Funding Information:
ACKNOWLEDGMENT All authors are thankful for research grants from Naval Research Lab N00173-15-G017, N0017319-1-G002 and National Science Foundation US DGE-1723440, OAC-1642031, SaTC-1528099.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/5
Y1 - 2019/5
N2 - Software Defined Networking (SDN) has emerged as a revolutionary paradigm to manage cloud infrastructure. SDN lacks scalable trust setup and verification mechanism between Data Plane-Control Plane elements, Control Plane elements, and Control Plane-Application Plane. Trust management schemes like Public Key Infrastructure (PKI) used currently in SDN are slow for trust establishment in a larger cloud environment. We propose a distributed trust mechanism - TRUFL to establish and verify trust in SDN. The distributed framework utilizes parallelism in trust management, in effect faster transfer rates and reduced latency compared to centralized trust management. The TRUFL framework scales well with the number of OpenFlow rules when compared to existing research works.
AB - Software Defined Networking (SDN) has emerged as a revolutionary paradigm to manage cloud infrastructure. SDN lacks scalable trust setup and verification mechanism between Data Plane-Control Plane elements, Control Plane elements, and Control Plane-Application Plane. Trust management schemes like Public Key Infrastructure (PKI) used currently in SDN are slow for trust establishment in a larger cloud environment. We propose a distributed trust mechanism - TRUFL to establish and verify trust in SDN. The distributed framework utilizes parallelism in trust management, in effect faster transfer rates and reduced latency compared to centralized trust management. The TRUFL framework scales well with the number of OpenFlow rules when compared to existing research works.
UR - http://www.scopus.com/inward/record.url?scp=85070191635&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85070191635&partnerID=8YFLogxK
U2 - 10.1109/ICC.2019.8761661
DO - 10.1109/ICC.2019.8761661
M3 - Conference contribution
AN - SCOPUS:85070191635
T3 - IEEE International Conference on Communications
BT - 2019 IEEE International Conference on Communications, ICC 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 20 May 2019 through 24 May 2019
ER -