TRUFL: Distributed Trust Management Framework in SDN

Ankur Chowdhary, Dijiang Huang, Adel Alshamrani, Myong Kang, Anya Kim, Alexander Velazquez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Software Defined Networking (SDN) has emerged as a revolutionary paradigm to manage cloud infrastructure. SDN lacks scalable trust setup and verification mechanism between Data Plane-Control Plane elements, Control Plane elements, and Control Plane-Application Plane. Trust management schemes like Public Key Infrastructure (PKI) used currently in SDN are slow for trust establishment in a larger cloud environment. We propose a distributed trust mechanism - TRUFL to establish and verify trust in SDN. The distributed framework utilizes parallelism in trust management, in effect faster transfer rates and reduced latency compared to centralized trust management. The TRUFL framework scales well with the number of OpenFlow rules when compared to existing research works.

Original languageEnglish (US)
Title of host publication2019 IEEE International Conference on Communications, ICC 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538680889
DOIs
StatePublished - May 1 2019
Event2019 IEEE International Conference on Communications, ICC 2019 - Shanghai, China
Duration: May 20 2019May 24 2019

Publication series

NameIEEE International Conference on Communications
Volume2019-May
ISSN (Print)1550-3607

Conference

Conference2019 IEEE International Conference on Communications, ICC 2019
CountryChina
CityShanghai
Period5/20/195/24/19

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • Cite this

    Chowdhary, A., Huang, D., Alshamrani, A., Kang, M., Kim, A., & Velazquez, A. (2019). TRUFL: Distributed Trust Management Framework in SDN. In 2019 IEEE International Conference on Communications, ICC 2019 - Proceedings [8761661] (IEEE International Conference on Communications; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICC.2019.8761661