Transient liquid phase (TLP) bonding for microsystem packaging applications

Warren Welch, Junseok Chae, Sang Hyun Lee, Navid Yazdi, Khalil Najafi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Scopus citations

Abstract

This paper explores the use of transient liquid phase bonding for microsystem packaging applications. Two types of bonds are demonstrated: a thin-film evaporated indium-gold bond and an electroplated nickel-tin bond. Both bonds are formed at 300°C for about 1.5 hours in a conventional wafer bonder. The wafers were heated to over 400 °C for more than an hour after bonding without any signs of bond degradation. The indium-gold bond demonstrated good electrical contact, but poor permeability performance. However, the nickel-tin bond was void free and sealed cavities with bond ring widths as little as 50 μm. The cross section of the nickel-tin TLP bond was analyzed with EDAX software to verify the formation of intermetallic compounds.

Original languageEnglish (US)
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages1350-1353
Number of pages4
StatePublished - Nov 9 2005
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: Jun 5 2005Jun 9 2005

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume2

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period6/5/056/9/05

Keywords

  • Diffusion Soldering
  • MEMS Packaging
  • Transient Liquid Phase

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Welch, W., Chae, J., Lee, S. H., Yazdi, N., & Najafi, K. (2005). Transient liquid phase (TLP) bonding for microsystem packaging applications. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers (pp. 1350-1353). [3E4.9] (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 2).