Transient liquid phase (TLP) bonding for microsystem packaging applications

Warren Welch, Junseok Chae, Sang Hyun Lee, Navid Yazdi, Khalil Najafi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Citations (Scopus)

Abstract

This paper explores the use of transient liquid phase bonding for microsystem packaging applications. Two types of bonds are demonstrated: a thin-film evaporated indium-gold bond and an electroplated nickel-tin bond. Both bonds are formed at 300°C for about 1.5 hours in a conventional wafer bonder. The wafers were heated to over 400 °C for more than an hour after bonding without any signs of bond degradation. The indium-gold bond demonstrated good electrical contact, but poor permeability performance. However, the nickel-tin bond was void free and sealed cavities with bond ring widths as little as 50 μm. The cross section of the nickel-tin TLP bond was analyzed with EDAX software to verify the formation of intermetallic compounds.

Original languageEnglish (US)
Title of host publicationDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Pages1350-1353
Number of pages4
Volume2
StatePublished - 2005
Externally publishedYes
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: Jun 5 2005Jun 9 2005

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period6/5/056/9/05

Fingerprint

Microsystems
Tin
Packaging
Nickel
Indium
Liquids
Gold
Intermetallics
Energy dispersive spectroscopy
Degradation
Thin films

Keywords

  • Diffusion Soldering
  • MEMS Packaging
  • Transient Liquid Phase

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Welch, W., Chae, J., Lee, S. H., Yazdi, N., & Najafi, K. (2005). Transient liquid phase (TLP) bonding for microsystem packaging applications. In Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05 (Vol. 2, pp. 1350-1353). [3E4.9]

Transient liquid phase (TLP) bonding for microsystem packaging applications. / Welch, Warren; Chae, Junseok; Lee, Sang Hyun; Yazdi, Navid; Najafi, Khalil.

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05. Vol. 2 2005. p. 1350-1353 3E4.9.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Welch, W, Chae, J, Lee, SH, Yazdi, N & Najafi, K 2005, Transient liquid phase (TLP) bonding for microsystem packaging applications. in Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05. vol. 2, 3E4.9, pp. 1350-1353, 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, Seoul, Korea, Republic of, 6/5/05.
Welch W, Chae J, Lee SH, Yazdi N, Najafi K. Transient liquid phase (TLP) bonding for microsystem packaging applications. In Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05. Vol. 2. 2005. p. 1350-1353. 3E4.9
Welch, Warren ; Chae, Junseok ; Lee, Sang Hyun ; Yazdi, Navid ; Najafi, Khalil. / Transient liquid phase (TLP) bonding for microsystem packaging applications. Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05. Vol. 2 2005. pp. 1350-1353
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