@inproceedings{b4b6a9ebd7074e94a2c53ef16b5768ba,
title = "Transient liquid phase (TLP) bonding for microsystem packaging applications",
abstract = "This paper explores the use of transient liquid phase bonding for microsystem packaging applications. Two types of bonds are demonstrated: a thin-film evaporated indium-gold bond and an electroplated nickel-tin bond. Both bonds are formed at 300°C for about 1.5 hours in a conventional wafer bonder. The wafers were heated to over 400 °C for more than an hour after bonding without any signs of bond degradation. The indium-gold bond demonstrated good electrical contact, but poor permeability performance. However, the nickel-tin bond was void free and sealed cavities with bond ring widths as little as 50 μm. The cross section of the nickel-tin TLP bond was analyzed with EDAX software to verify the formation of intermetallic compounds.",
keywords = "Diffusion Soldering, MEMS Packaging, Transient Liquid Phase",
author = "Warren Welch and Junseok Chae and Lee, {Sang Hyun} and Navid Yazdi and Khalil Najafi",
note = "Copyright: Copyright 2008 Elsevier B.V., All rights reserved.; 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",
year = "2005",
language = "English (US)",
isbn = "0780389948",
series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
pages = "1350--1353",
booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",
}