Transfer of metal MEMS packages using a wafer-level solder transfer technique

Warren C. Welch, Junseok Chae, Khalil Najafi

Research output: Contribution to journalArticlepeer-review

48 Scopus citations

Fingerprint

Dive into the research topics of 'Transfer of metal MEMS packages using a wafer-level solder transfer technique'. Together they form a unique fingerprint.

Engineering & Materials Science