Titanium nitridation on copper surfaces

S. W. Russell, M. J. Rock, Daniel Adams, Terry Alford, T. E. Levine, M. Nastasi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Cu74Ti26 alloy films were annealed in flowing NH3 at temperatures of 450 to 700°C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectroscopy were applied to investigate the chemistry of the as-formed nitride as a function of anneal temperature. The use of these two techniques in tandem offers a combination of standardless compositional determination, excellent mass and depth resolution, and chemical bonding information. The Ti:N ratio is nearly 1.0 for T ≥ 550°C, and the nitride contains ∼ 6 atom percent O. The amount of nitrogen incorporated increases with temperature with an activation energy of 0.6 eV. A native Ti oxide remaining at the TiN/Cu interface suggests Ti is the dominant diffusing species during nitridation.

Original languageEnglish (US)
Pages (from-to)2349-2353
Number of pages5
JournalJournal of the Electrochemical Society
Volume143
Issue number7
StatePublished - Jul 1996

Fingerprint

Nitridation
Titanium
Copper
titanium
Nitrides
copper
nitrides
Auger electron spectroscopy
metal films
Temperature
Oxides
Auger spectroscopy
temperature
electron spectroscopy
Nitrogen
Activation energy
Metals
chemistry
activation energy
nitrogen

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Russell, S. W., Rock, M. J., Adams, D., Alford, T., Levine, T. E., & Nastasi, M. (1996). Titanium nitridation on copper surfaces. Journal of the Electrochemical Society, 143(7), 2349-2353.

Titanium nitridation on copper surfaces. / Russell, S. W.; Rock, M. J.; Adams, Daniel; Alford, Terry; Levine, T. E.; Nastasi, M.

In: Journal of the Electrochemical Society, Vol. 143, No. 7, 07.1996, p. 2349-2353.

Research output: Contribution to journalArticle

Russell, SW, Rock, MJ, Adams, D, Alford, T, Levine, TE & Nastasi, M 1996, 'Titanium nitridation on copper surfaces', Journal of the Electrochemical Society, vol. 143, no. 7, pp. 2349-2353.
Russell SW, Rock MJ, Adams D, Alford T, Levine TE, Nastasi M. Titanium nitridation on copper surfaces. Journal of the Electrochemical Society. 1996 Jul;143(7):2349-2353.
Russell, S. W. ; Rock, M. J. ; Adams, Daniel ; Alford, Terry ; Levine, T. E. ; Nastasi, M. / Titanium nitridation on copper surfaces. In: Journal of the Electrochemical Society. 1996 ; Vol. 143, No. 7. pp. 2349-2353.
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