Titanium nitridation on copper surfaces

S. W. Russell; M. J. Rock; Daniel Adams; Terry Alford; T. E. Levine; M. Nastasi

doi:10.1149/1.1837005

Titanium nitridation on copper surfaces

S. W. Russell, M. J. Rock, Daniel Adams, Terry Alford, T. E. Levine, M. Nastasi

Chemical Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Cu₇₄Ti₂₆ alloy films were annealed in flowing NH₃ at temperatures of 450 to 700°C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectroscopy were applied to investigate the chemistry of the as-formed nitride as a function of anneal temperature. The use of these two techniques in tandem offers a combination of standardless compositional determination, excellent mass and depth resolution, and chemical bonding information. The Ti:N ratio is nearly 1.0 for T ≥ 550°C, and the nitride contains ∼ 6 atom percent O. The amount of nitrogen incorporated increases with temperature with an activation energy of 0.6 eV. A native Ti oxide remaining at the TiN/Cu interface suggests Ti is the dominant diffusing species during nitridation.

Original language	English (US)
Pages (from-to)	2349-2353
Number of pages	5
Journal	Journal of the Electrochemical Society
Volume	143
Issue number	7
DOIs	https://doi.org/10.1149/1.1837005
State	Published - Jul 1996

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Surfaces, Coatings and Films
Electrochemistry
Renewable Energy, Sustainability and the Environment

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10.1149/1.1837005

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title = "Titanium nitridation on copper surfaces",

abstract = "Cu74Ti26 alloy films were annealed in flowing NH3 at temperatures of 450 to 700°C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectroscopy were applied to investigate the chemistry of the as-formed nitride as a function of anneal temperature. The use of these two techniques in tandem offers a combination of standardless compositional determination, excellent mass and depth resolution, and chemical bonding information. The Ti:N ratio is nearly 1.0 for T ≥ 550°C, and the nitride contains ∼ 6 atom percent O. The amount of nitrogen incorporated increases with temperature with an activation energy of 0.6 eV. A native Ti oxide remaining at the TiN/Cu interface suggests Ti is the dominant diffusing species during nitridation.",

author = "Russell, {S. W.} and Rock, {M. J.} and Daniel Adams and Terry Alford and Levine, {T. E.} and M. Nastasi",

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T1 - Titanium nitridation on copper surfaces

AU - Russell, S. W.

AU - Rock, M. J.

AU - Adams, Daniel

AU - Alford, Terry

AU - Levine, T. E.

AU - Nastasi, M.

PY - 1996/7

Y1 - 1996/7

N2 - Cu74Ti26 alloy films were annealed in flowing NH3 at temperatures of 450 to 700°C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectroscopy were applied to investigate the chemistry of the as-formed nitride as a function of anneal temperature. The use of these two techniques in tandem offers a combination of standardless compositional determination, excellent mass and depth resolution, and chemical bonding information. The Ti:N ratio is nearly 1.0 for T ≥ 550°C, and the nitride contains ∼ 6 atom percent O. The amount of nitrogen incorporated increases with temperature with an activation energy of 0.6 eV. A native Ti oxide remaining at the TiN/Cu interface suggests Ti is the dominant diffusing species during nitridation.

AB - Cu74Ti26 alloy films were annealed in flowing NH3 at temperatures of 450 to 700°C. Ti segregates to the free surface to form TiN, leaving nearly pure Cu in the remaining metal film. Elastic recoil detection and Auger electron spectroscopy were applied to investigate the chemistry of the as-formed nitride as a function of anneal temperature. The use of these two techniques in tandem offers a combination of standardless compositional determination, excellent mass and depth resolution, and chemical bonding information. The Ti:N ratio is nearly 1.0 for T ≥ 550°C, and the nitride contains ∼ 6 atom percent O. The amount of nitrogen incorporated increases with temperature with an activation energy of 0.6 eV. A native Ti oxide remaining at the TiN/Cu interface suggests Ti is the dominant diffusing species during nitridation.

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Titanium nitridation on copper surfaces

Abstract

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