Time-dependent reliability analysis using efficient bayesian method

Xuefei Guan, Jingjing He, Ratneshwar Jha, Yongming Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The paper presents an efficient method for time-dependent reliability analysis. Proba- bilistic modeling is used to quantify uncertainties and additional information is incorporated using Bayes theorem to perform various updating and reduce inference uncertainty. To im- prove the computational efficiency, Laplace approximation and inverse reliability methods are proposed to evaluate the Bayesian posterior distributions and reliability responses, respectively. A numerical example and and fatigue reliability application are presented to demonstrate the overall methodology. The efficiency and effectiveness of the proposed method is compared with traditional simulation-based method.

Original languageEnglish (US)
Title of host publication53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
StatePublished - Dec 1 2012
Externally publishedYes
Event53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference - Honolulu, HI, United States
Duration: Apr 23 2012Apr 26 2012

Publication series

NameCollection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
ISSN (Print)0273-4508

Other

Other53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
CountryUnited States
CityHonolulu, HI
Period4/23/124/26/12

ASJC Scopus subject areas

  • Architecture
  • Materials Science(all)
  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Guan, X., He, J., Jha, R., & Liu, Y. (2012). Time-dependent reliability analysis using efficient bayesian method. In 53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference [AIAA 2012-1593] (Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference).