Ti/Al/Ni/Au Ohmic contacts for AlInN/AlN/GaN-based heterojunction field-effect transistors

Lin Zhou, Jacob H. Leach, Xianfeng Ni, Hadis Morko̧, David Smith

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

The microstructure of AuNiAlTi/Al0.84In0.16N/AlN/GaN Ohmic contacts annealed from 700 to 900 °C has been determined using transmission electron microscopy and associated analytical techniques. Intermixing and phase separation of the metal contact layers was observed to degrade the surface roughness. An optimal contact performance was obtained for contacts annealed at 800 °C and was attributed to the formation of TiN contact inclusions that had penetrated through the AlInN layers into the GaN layers underneath. These TiN contact inclusions had an inverted mushroom shape with a density of ∼ 108 cm-2, and they were invariably located at the positions of mixed-type threading dislocations. These inclusion defects would act as a conduction path between the metal contacts and the two-dimensional electron gas of heterojunction field-effect transistor devices. The AlInN layer remained intact in dislocation-free areas of all samples.

Original languageEnglish (US)
Article number014508
JournalJournal of Applied Physics
Volume107
Issue number1
DOIs
StatePublished - 2010

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heterojunctions
electric contacts
field effect transistors
inclusions
metals
electron gas
surface roughness
conduction
transmission electron microscopy
microstructure
defects

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Ti/Al/Ni/Au Ohmic contacts for AlInN/AlN/GaN-based heterojunction field-effect transistors. / Zhou, Lin; Leach, Jacob H.; Ni, Xianfeng; Morko̧, Hadis; Smith, David.

In: Journal of Applied Physics, Vol. 107, No. 1, 014508, 2010.

Research output: Contribution to journalArticle

Zhou, Lin ; Leach, Jacob H. ; Ni, Xianfeng ; Morko̧, Hadis ; Smith, David. / Ti/Al/Ni/Au Ohmic contacts for AlInN/AlN/GaN-based heterojunction field-effect transistors. In: Journal of Applied Physics. 2010 ; Vol. 107, No. 1.
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