THz on-wafer calibration using offset-shorts and known through as standards

Cosan Caglayan, Georgios C. Trichopoulos, Kubilay Sertel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a novel on-wafer calibration technique using well-defined standards that can be an alternative to widely used multiline-TRL (thru-reflect-line) calibration in millimeter and submillimeter waves. Our method is specifically useful in measurement setups with fixed probes since TRL-type calibration typically requires different physical separation between measurement probes. As on-wafer standards, offset shorts with different electrical delay lengths and a simple through connection are used. Experimental validation of this calibration method is provided in G-Band (140-220 GHz) via measurement of a Beatty standard (mismatched thru) using non-contact probes.

Original languageEnglish (US)
Title of host publication2014 IEEE National Aerospace and Electronics Conference, NAECON 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages308-309
Number of pages2
ISBN (Electronic)9781479946891
DOIs
StatePublished - Feb 19 2015
Externally publishedYes
EventIEEE National Aerospace and Electronics Conference, NAECON 2014 - Dayton, United States
Duration: Jun 24 2014Jun 27 2014

Publication series

NameNational Aerospace and Electronics Conference, Proceedings of the IEEE
Volume2015-February

Other

OtherIEEE National Aerospace and Electronics Conference, NAECON 2014
CountryUnited States
CityDayton
Period6/24/146/27/14

Keywords

  • millimeter waves
  • on-wafer measurements
  • sub-millimeter waves
  • terahertz

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Aerospace Engineering

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    Caglayan, C., Trichopoulos, G. C., & Sertel, K. (2015). THz on-wafer calibration using offset-shorts and known through as standards. In 2014 IEEE National Aerospace and Electronics Conference, NAECON 2014 (pp. 308-309). [7045823] (National Aerospace and Electronics Conference, Proceedings of the IEEE; Vol. 2015-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NAECON.2014.7045823