Three-dimensional topography simulation based on a level set method [deposition and etching processes]

A. Sheikholeslami, C. Heitzinger, F. Badrieh, H. Puchner, S. Selberherr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We present a general 3D topography simulator for the simulation of deposition and etching processes. The simulator is called ELSA (enhanced level set applications). ELSA is based on a level set method including narrow banding and a fast marching method. Modules for the transport of species, for surface reaction, and for the level set method are its basis.

Original languageEnglish (US)
Title of host publication27th International Spring Seminar on Electronics Technology
Subtitle of host publicationMeeting the Challenges of Electronics Technology Progress, ISSE 2004 - Conference Proceedings
PublisherIEEE Computer Society
Pages263-265
Number of pages3
ISBN (Electronic)0780384229
DOIs
StatePublished - Jan 1 2004
Event27th International Spring Seminar on Electronics Technology, ISSE 2004 - Bankya, Bulgaria
Duration: May 13 2004May 16 2004

Publication series

NameProceedings of the International Spring Seminar on Electronics Technology
Volume2
ISSN (Print)2161-2528
ISSN (Electronic)2161-2536

Other

Other27th International Spring Seminar on Electronics Technology, ISSE 2004
CountryBulgaria
CityBankya
Period5/13/045/16/04

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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