Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning

R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticle

66 Scopus citations

Abstract

Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder was investigated. The 3D microstructure of near-eutectic Sn-3.5Ag solder was modeled by computer-aided reconstruction of micrographs. The serial sectioning process enabled the reconstruction, visualization, and measurement of the size and aspect ratio of the solder. A comparison of size and aspect ratio from 2D and 3D measurements shows that measurements in 3D are much more accurate.

Original languageEnglish (US)
Pages (from-to)225-230
Number of pages6
JournalMaterials Characterization
Volume52
Issue number3
DOIs
StatePublished - Jun 1 2004

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ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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