Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder

R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

We report on three-dimensional (3D) microstructure visualization and finite-element method modeling of deformation in Sn-3.5Ag alloy. The 3D virtual microstructure accurately represented the alignment, aspect ratio, and distribution of the Ag3Sn second phase. The 3D microstructure-based approach is more accurate than unit cell models for simulating and understanding material behavior.

Original languageEnglish (US)
Pages (from-to)1627-1631
Number of pages5
JournalScripta Materialia
Volume54
Issue number9
DOIs
StatePublished - May 2006

Fingerprint

solders
Soldering alloys
Visualization
microstructure
Microstructure
aspect ratio
Aspect ratio
finite element method
alignment
Finite element method
cells

Keywords

  • Deformation
  • Finite element method
  • pb-Free solder
  • Three-dimensional microstructure

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Metals and Alloys

Cite this

Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder. / Sidhu, R. S.; Chawla, Nikhilesh.

In: Scripta Materialia, Vol. 54, No. 9, 05.2006, p. 1627-1631.

Research output: Contribution to journalArticle

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