Three-dimensional (3D) microstructure visualization of LaSn3 intermetallics in a novel Sn-rich rare-earth-containing solder

M. A. Dudek, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

35 Scopus citations


The 3D morphology of LaSn3 intermetallics in a near eutectic Sn-3.9Ag-0.7Cu solder containing small amounts of La was studied using a serial sectioning method. The serial sectioning process enabled visualization of the complexity of these intermetallics, and revealed their interconnected structure. The morphology of these phases would have been severely misrepresented by traditional 2D microstructural characterization.

Original languageEnglish (US)
Pages (from-to)1364-1368
Number of pages5
JournalMaterials Characterization
Issue number9
StatePublished - Sep 2008


  • Microstructure characterization
  • Pb-free solder
  • Serial sectioning
  • Three dimensional

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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