Engineering & Materials Science
Low-k dielectric
100%
Thin films
63%
Hydrogen
53%
Oxygen
16%
Sheet resistance
14%
Plasmas
14%
Atoms
10%
Thermal desorption spectroscopy
9%
Rutherford backscattering spectroscopy
9%
Temperature
8%
Auger electron spectroscopy
8%
Secondary ion mass spectrometry
7%
Lattice constants
7%
Silicides
7%
Reaction products
6%
Spectrometry
6%
Solid solutions
5%
X ray diffraction
5%
Moisture
4%
Chemical analysis
3%
Physics & Astronomy
barrier layers
72%
hydrogen
41%
thin films
34%
interactions
26%
oxygen atoms
10%
oxygen
6%
reaction products
5%
moisture
5%
spectroscopy
5%
silicides
5%
secondary ion mass spectrometry
5%
Auger spectroscopy
5%
electron spectroscopy
5%
backscattering
4%
desorption
4%
lattice parameters
4%
solid solutions
4%
electrical resistivity
3%
expansion
3%
probes
3%
temperature
3%
diffraction
2%
x rays
2%
Chemical Compounds
Dielectric Material
59%
Hydrogen
34%
Sheet Resistance
12%
Oxygen Atom
8%
Nuclear Resonance
8%
Elastic Recoil Detection
7%
Liquid Film
7%
Thermal Desorption Spectroscopy
7%
Rutherford Backscattering Spectroscopy
6%
Auger Electron Spectroscopy
5%
Secondary Ion Mass Spectroscopy
5%
Dioxygen
5%
Lattice Parameter
5%
Solid Solution
4%
X-Ray Diffraction
2%
Amount
2%