Thermoresponsiveness of integrated ultra-thin silicon with poly(N-isopropylacrylamide) hydrogels

Cunjiang Yu, Yuping Pan, Huan Ma, Teng Ma, Jiaping Zhang, Yanmei Song, M. Yashar S Kalani, Lenore Dai, Hanqing Jiang

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Stimuli-sensitive polymer materials have limited device functionality, design and manufacturing flexibility although they are pushed to enable smart device applications. Here we demonstrate the capability of integrating thermoresponsive poly(N-isopropylacrylamide) (PNIPAAm) hydrogels with silicon nanoribbons, and enable the stiff silicon ribbons to become adaptive and drivable by the soft environmentally sensitive substrate, such as becoming mechanically stretched and compressed on temperature change. These and related soft/hard smart devices and systems may open new opportunities in biomedical applications.

Original languageEnglish (US)
Pages (from-to)820-824
Number of pages5
JournalMacromolecular Rapid Communications
Volume32
Issue number11
DOIs
StatePublished - Jun 1 2011

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Hydrogels
Silicon
Nanoribbons
Carbon Nanotubes
Open systems
Polymers
Substrates
Temperature
poly-N-isopropylacrylamide

Keywords

  • elastomers
  • environmentally sensitive
  • hydrogels
  • silicon nanoribbons
  • thermoresponsive

ASJC Scopus subject areas

  • Organic Chemistry
  • Materials Chemistry
  • Polymers and Plastics

Cite this

Thermoresponsiveness of integrated ultra-thin silicon with poly(N-isopropylacrylamide) hydrogels. / Yu, Cunjiang; Pan, Yuping; Ma, Huan; Ma, Teng; Zhang, Jiaping; Song, Yanmei; Kalani, M. Yashar S; Dai, Lenore; Jiang, Hanqing.

In: Macromolecular Rapid Communications, Vol. 32, No. 11, 01.06.2011, p. 820-824.

Research output: Contribution to journalArticle

Yu, Cunjiang ; Pan, Yuping ; Ma, Huan ; Ma, Teng ; Zhang, Jiaping ; Song, Yanmei ; Kalani, M. Yashar S ; Dai, Lenore ; Jiang, Hanqing. / Thermoresponsiveness of integrated ultra-thin silicon with poly(N-isopropylacrylamide) hydrogels. In: Macromolecular Rapid Communications. 2011 ; Vol. 32, No. 11. pp. 820-824.
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