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Thermomechanical behaviour of environmentally benign Pb-free solders
Nikhilesh Chawla
Materials Science and Engineering
Chemical Engineering
Engineering of Matter, Transport and Energy, School for (IAFSE-SEMTE)
Engineering, Ira A. Fulton Schools of (IAFSE)
Research output
:
Contribution to journal
›
Review article
›
peer-review
84
Scopus citations
Overview
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Engineering & Materials Science
Lead-free solders
100%
Soldering alloys
79%
Thermal fatigue
59%
Creep
41%
Health hazards
22%
Fatigue of materials
22%
Electronics packaging
20%
Electronics industry
19%
Toxicity
19%
Metallizing
18%
Melting point
17%
Intermetallics
17%
Eutectics
17%
Precipitates
16%
Wetting
16%
Substitution reactions
15%
Lead
14%
Networks (circuits)
8%
Chemical Compounds
Solder
99%
Thermal Fatigue
83%
Creep
59%
Alloy
45%
Fatigue Strength
26%
Resistance
20%
Hazardous Substance
18%
Eutectics
16%
Shear
14%
Drop
13%
Amount
13%
Melting Point
13%
Industry
11%
Substitution Reaction
10%