Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy – A combined experimental and modeling study

C. Kale, S. Turnage, P. Garg, I. Adlakha, S. Srinivasan, B. C. Hornbuckle, K. Darling, Kiran Solanki

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

An immiscible nanocrystalline (NC) copper-tantalum (Cu-Ta) alloy is shown to exhibit a stable microstructure under thermo-mechanical loading conditions with exceptional mechanical strength (i.e., 1200 MPa strength at 298 K) indicating anomalous deformation mechanisms as compared to microstructurally unstable nanocrystalline materials. Therefore, in this work, various aspects of strength partitioning in such NC Cu-Ta alloys are discussed and the role of tantalum nanoclusters on the dominant deformation mechanism is presented as a function of temperature. Toward this, initially, the mechanical responses of NC Cu-Ta alloy were measured under uniaxial compression experiments at various temperatures. Later, atomistic simulations were performed along with the high-resolution electron microscopy to identify and validate the rate limiting mechanism behind the plastic deformation in NC Cu-Ta alloys. In general, the observed trend through experiments and simulations identify a transition from a dislocation – nanocluster interaction mediated deformation mechanism to one controlled by grain boundary strengthening as the temperature increases. The former mechanism is shown here to have a crucial role in the observed strengthening behavior of microstructurally stable NC materials. Overall, the paper demonstrates that through effective nano-engineering techniques, it is expected to extend the scope of nanocrystalline materials to a number of engineering design applications.

Original languageEnglish (US)
Article number107551
JournalMaterials and Design
Volume163
DOIs
StatePublished - Feb 5 2019

Fingerprint

Nanocrystalline alloys
Binary alloys
Strengthening (metal)
Nanocrystalline materials
Tantalum
Nanoclusters
High resolution electron microscopy
Temperature
Strength of materials
Copper
Plastic deformation
Grain boundaries
Compaction
Experiments
Microstructure

Keywords

  • Atomistic
  • Deformation
  • Nanocrystalline
  • Transmission electron microscopy

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy – A combined experimental and modeling study. / Kale, C.; Turnage, S.; Garg, P.; Adlakha, I.; Srinivasan, S.; Hornbuckle, B. C.; Darling, K.; Solanki, Kiran.

In: Materials and Design, Vol. 163, 107551, 05.02.2019.

Research output: Contribution to journalArticle

Kale, C. ; Turnage, S. ; Garg, P. ; Adlakha, I. ; Srinivasan, S. ; Hornbuckle, B. C. ; Darling, K. ; Solanki, Kiran. / Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy – A combined experimental and modeling study. In: Materials and Design. 2019 ; Vol. 163.
@article{91ac48c2b84e4b2fbfbda9f6ddbc8744,
title = "Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy – A combined experimental and modeling study",
abstract = "An immiscible nanocrystalline (NC) copper-tantalum (Cu-Ta) alloy is shown to exhibit a stable microstructure under thermo-mechanical loading conditions with exceptional mechanical strength (i.e., 1200 MPa strength at 298 K) indicating anomalous deformation mechanisms as compared to microstructurally unstable nanocrystalline materials. Therefore, in this work, various aspects of strength partitioning in such NC Cu-Ta alloys are discussed and the role of tantalum nanoclusters on the dominant deformation mechanism is presented as a function of temperature. Toward this, initially, the mechanical responses of NC Cu-Ta alloy were measured under uniaxial compression experiments at various temperatures. Later, atomistic simulations were performed along with the high-resolution electron microscopy to identify and validate the rate limiting mechanism behind the plastic deformation in NC Cu-Ta alloys. In general, the observed trend through experiments and simulations identify a transition from a dislocation – nanocluster interaction mediated deformation mechanism to one controlled by grain boundary strengthening as the temperature increases. The former mechanism is shown here to have a crucial role in the observed strengthening behavior of microstructurally stable NC materials. Overall, the paper demonstrates that through effective nano-engineering techniques, it is expected to extend the scope of nanocrystalline materials to a number of engineering design applications.",
keywords = "Atomistic, Deformation, Nanocrystalline, Transmission electron microscopy",
author = "C. Kale and S. Turnage and P. Garg and I. Adlakha and S. Srinivasan and Hornbuckle, {B. C.} and K. Darling and Kiran Solanki",
year = "2019",
month = "2",
day = "5",
doi = "10.1016/j.matdes.2018.107551",
language = "English (US)",
volume = "163",
journal = "Materials and Design",
issn = "0261-3069",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy – A combined experimental and modeling study

AU - Kale, C.

AU - Turnage, S.

AU - Garg, P.

AU - Adlakha, I.

AU - Srinivasan, S.

AU - Hornbuckle, B. C.

AU - Darling, K.

AU - Solanki, Kiran

PY - 2019/2/5

Y1 - 2019/2/5

N2 - An immiscible nanocrystalline (NC) copper-tantalum (Cu-Ta) alloy is shown to exhibit a stable microstructure under thermo-mechanical loading conditions with exceptional mechanical strength (i.e., 1200 MPa strength at 298 K) indicating anomalous deformation mechanisms as compared to microstructurally unstable nanocrystalline materials. Therefore, in this work, various aspects of strength partitioning in such NC Cu-Ta alloys are discussed and the role of tantalum nanoclusters on the dominant deformation mechanism is presented as a function of temperature. Toward this, initially, the mechanical responses of NC Cu-Ta alloy were measured under uniaxial compression experiments at various temperatures. Later, atomistic simulations were performed along with the high-resolution electron microscopy to identify and validate the rate limiting mechanism behind the plastic deformation in NC Cu-Ta alloys. In general, the observed trend through experiments and simulations identify a transition from a dislocation – nanocluster interaction mediated deformation mechanism to one controlled by grain boundary strengthening as the temperature increases. The former mechanism is shown here to have a crucial role in the observed strengthening behavior of microstructurally stable NC materials. Overall, the paper demonstrates that through effective nano-engineering techniques, it is expected to extend the scope of nanocrystalline materials to a number of engineering design applications.

AB - An immiscible nanocrystalline (NC) copper-tantalum (Cu-Ta) alloy is shown to exhibit a stable microstructure under thermo-mechanical loading conditions with exceptional mechanical strength (i.e., 1200 MPa strength at 298 K) indicating anomalous deformation mechanisms as compared to microstructurally unstable nanocrystalline materials. Therefore, in this work, various aspects of strength partitioning in such NC Cu-Ta alloys are discussed and the role of tantalum nanoclusters on the dominant deformation mechanism is presented as a function of temperature. Toward this, initially, the mechanical responses of NC Cu-Ta alloy were measured under uniaxial compression experiments at various temperatures. Later, atomistic simulations were performed along with the high-resolution electron microscopy to identify and validate the rate limiting mechanism behind the plastic deformation in NC Cu-Ta alloys. In general, the observed trend through experiments and simulations identify a transition from a dislocation – nanocluster interaction mediated deformation mechanism to one controlled by grain boundary strengthening as the temperature increases. The former mechanism is shown here to have a crucial role in the observed strengthening behavior of microstructurally stable NC materials. Overall, the paper demonstrates that through effective nano-engineering techniques, it is expected to extend the scope of nanocrystalline materials to a number of engineering design applications.

KW - Atomistic

KW - Deformation

KW - Nanocrystalline

KW - Transmission electron microscopy

UR - http://www.scopus.com/inward/record.url?scp=85058703368&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85058703368&partnerID=8YFLogxK

U2 - 10.1016/j.matdes.2018.107551

DO - 10.1016/j.matdes.2018.107551

M3 - Article

VL - 163

JO - Materials and Design

JF - Materials and Design

SN - 0261-3069

M1 - 107551

ER -