Thermal stability of microscale additively manufactured copper using pulsed electrodeposition

Physics & Astronomy

• electrodeposition 69%
• microbalances 66%
• printing 65%
• thermal stability 57%
• voids 57%
• copper 47%
• damage 47%
• metals 33%
• mechanical properties 22%
• sensors 20%
• annealing 19%
• electronics 17%
• temperature 9%

Engineering & Materials Science

• Electrodeposition 84%
• Thermodynamic stability 68%
• 3D printers 65%
• Copper 53%
• Metals 42%
• Annealing 32%
• Electronic equipment 27%
• Materials properties 27%
• Temperature 26%
• Mechanical properties 21%
• Sensors 16%

Chemical Compounds

• Surface Damage 100%
• Electrodeposition 55%
• Thermal Stability 43%
• Strength 42%
• Metal 29%
• Annealing 26%