Abstract
Thermal peeling stress between a thin film and the substrate is caused by the mismatch of thermal expansion coefficient under a temperature change. The thermal peeling stress resulting from the temperature decrease from ambient to operating conditions (cryogenic temperatures) between a thin-film high-temperature superconductor and its substrate is calculated using finite element analysis (FEA). The superconductor thin film is idealized as a long bridge on a large substrate. A two-dimensional FEA model is applied to calculate the tensile (peeling) stress at the thin film/substrate interface. Results are obtained for different geometries and temperature conditions, and these results are compared with analytical predictions. A stress singularity is found at the very edge of the thin film which is not predicted by the analytical prediction. The peeling stress can be very high due to this stress singularity, even if the temperature change is not very large. The singular stress area depends on the local geometry of the edge. One can prevent the high singular stress by appropriate geometry. Therefore, refining the geometry of the thin-film HTS device is important.
| Original language | English (US) |
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| Title of host publication | American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD |
| Editors | P.H. Oosthuizen, M.A. Ebadian, C.T. Avedesian, Y. Bayazitoglu, P. Jones, J. Peterson |
| Publisher | ASME |
| Pages | 103-109 |
| Number of pages | 7 |
| Volume | 323 |
| Edition | 1 |
| State | Published - 1996 |
| Event | Proceedings of the 1996 31st ASME National Heat Transfer Conference. Part 2 (of 8) - Houston, TX, USA Duration: Aug 3 1996 → Aug 6 1996 |
Other
| Other | Proceedings of the 1996 31st ASME National Heat Transfer Conference. Part 2 (of 8) |
|---|---|
| City | Houston, TX, USA |
| Period | 8/3/96 → 8/6/96 |
ASJC Scopus subject areas
- Fluid Flow and Transfer Processes
- Mechanical Engineering