Thermal fatigue behavior of Sn-Rich (Pb-Free) solders

R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticle

25 Scopus citations

Abstract

The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.

Original languageEnglish (US)
Pages (from-to)799-810
Number of pages12
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume39 A
Issue number4
DOIs
StatePublished - Apr 1 2008

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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