Thermal fatigue behavior of Sn-Rich (Pb-Free) solders

R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.

Original languageEnglish (US)
Pages (from-to)799-810
Number of pages12
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume39 A
Issue number4
DOIs
StatePublished - Apr 2008

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Thermal fatigue
Soldering alloys
Microstructure
Geometry
Fatigue damage
Thermal cycling
Factor analysis
Crack initiation
Nucleation
Fatigue of materials
Cracks
Finite element method
Scanning electron microscopy
Lead-free solders

ASJC Scopus subject areas

  • Materials Science(all)
  • Metals and Alloys

Cite this

Thermal fatigue behavior of Sn-Rich (Pb-Free) solders. / Sidhu, R. S.; Chawla, Nikhilesh.

In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 39 A, No. 4, 04.2008, p. 799-810.

Research output: Contribution to journalArticle

@article{81f45785faab4c9d9531889f0db0facc,
title = "Thermal fatigue behavior of Sn-Rich (Pb-Free) solders",
abstract = "The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.",
author = "Sidhu, {R. S.} and Nikhilesh Chawla",
year = "2008",
month = "4",
doi = "10.1007/s11661-008-9480-y",
language = "English (US)",
volume = "39 A",
pages = "799--810",
journal = "Metallurgical and Materials Transactions B",
issn = "0360-2141",
publisher = "Springer Boston",
number = "4",

}

TY - JOUR

T1 - Thermal fatigue behavior of Sn-Rich (Pb-Free) solders

AU - Sidhu, R. S.

AU - Chawla, Nikhilesh

PY - 2008/4

Y1 - 2008/4

N2 - The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.

AB - The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.

UR - http://www.scopus.com/inward/record.url?scp=40549124356&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=40549124356&partnerID=8YFLogxK

U2 - 10.1007/s11661-008-9480-y

DO - 10.1007/s11661-008-9480-y

M3 - Article

VL - 39 A

SP - 799

EP - 810

JO - Metallurgical and Materials Transactions B

JF - Metallurgical and Materials Transactions B

SN - 0360-2141

IS - 4

ER -