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Thermal contact conductance across filled polyimide films at cryogenic temperatures
L. Zhao,
Patrick Phelan
Mechanical and Aerospace Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
33
Scopus citations
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Physics & Astronomy
thermal resistance
89%
cryogenic temperature
88%
polyimides
84%
electric contacts
72%
Kapton (trademark)
64%
interstitials
42%
contact resistance
34%
conduction
21%
high voltages
14%
aluminum oxides
13%
copper
11%
temperature
4%
Chemical Compounds
Thermal Resistance
100%
Cryogenics
90%
Polyimide Macromolecule
79%
Conductance
78%
Interstitial
51%
Contact Resistance
41%
Liquid Film
39%
Resistance
20%
Pressure
19%
Voltage
11%
Engineering & Materials Science
Polyimides
96%
Cryogenics
86%
Heat resistance
82%
Hot Temperature
39%
Contact resistance
37%
Temperature
32%
Alumina
16%
Copper
13%
Electric potential
8%