Thermal boundary resistance for thin-film high-Tc superconductors at varying interfacial temperature drops

Mukul Kelkar, Patrick Phelan, Bei Gu

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

High-temperature thin-film superconducting devices are becoming commonplace for applications such as Josephson junctions, superconducting quantum interference devices, interconnects and radiation bolometers. The thermal stability of these devices is critical and for effective heat transfer it is required to know the thermal boundary resistance at the interface of the high-Tc thin films and their substrates. Many measurements of thermal contact resistance for bulk samples and metallic thin films have been reported, but only a few measurements have been made for high-Tc films. In the present study, the thermal boundary resistance between Er-Ba-Cu-O films on MgO and SrTiO3 substrates is measured as a function of both temperature and the applied heat flux, and for the first time at temperatures as low as 19 K. The boundary resistance shows a decrease with increasing heat flux. Possible explanations for this trend are given by three proposed hypotheses.

Original languageEnglish (US)
Pages (from-to)2637-2645
Number of pages9
JournalInternational Journal of Heat and Mass Transfer
Volume40
Issue number11
DOIs
StatePublished - Jul 1997

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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