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Dive into the research topics of 'Thermal and mechanical stability of Ce-containing Sn-3.9Ag-0.7Cu lead-free solder on Cu and electroless Ni-P metallizations'. Together they form a unique fingerprint.- Sort by
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Huxiao Xie, Nikhilesh Chawla, Kabir Mirpuri
Research output: Contribution to journal › Article › peer-review