Thermal analysis and characterization of a high Q film bulk acoustic resonator (FBAR) as biosensers in liquids

Xu Zhang, Wencheng Xu, Abbas Abbaspour Tamijani, Junseok Chae

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

This paper presents the thermal analysis and characterization of a zinc oxide (ZnO) based film bulk acoustic resonator (FBAR) having a high quality factor (Q) in liquid environments for biosensing applications. Q of up to 120, an improvement of at least 8x greater than state-of-the-art devices in liquids, are achieved by integrating microfluidic channels with heights comparable to the acoustic wavelength in FBAR. In order to achieve temperature stability in the highly sensitive FBAR sensor, we analyze sources of thermal effects and characterize FBAR in a Pierce oscillator. Measurements show a temperature coefficient of oscillation frequency (TCF) of -112 ppm/K for the uncompensated circuit. We show that this thermal drift can be reduced to less than lppm/K by applying a properly chosen bias to the oscillator, which suggests the possibility of a feedback approach to achieve thermal stability.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages939-942
Number of pages4
DOIs
Publication statusPublished - 2009
Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
Duration: Jan 25 2009Jan 29 2009

Other

Other22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
CountryItaly
CitySorrento
Period1/25/091/29/09

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Zhang, X., Xu, W., Tamijani, A. A., & Chae, J. (2009). Thermal analysis and characterization of a high Q film bulk acoustic resonator (FBAR) as biosensers in liquids. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 939-942). [4805539] https://doi.org/10.1109/MEMSYS.2009.4805539