TY - GEN
T1 - The successive-initiation modeling strategy for modeling damage progression
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
AU - Ladani, Leila Jannesari
AU - Dasgupta, Abhijit
PY - 2006
Y1 - 2006
N2 - This study presents simulation of damage initiation and propagation in solder joints with voids, under thermomechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the boundary conditions in a local model which focuses on the details of the critical solder ball. The local model is error-seeded with voids of different sizes and locations. A continuum cyclic creepfatigue damage model based on energy-partitioning is used as the damage ctirerion. A method of successive initiation is used to model the growth of damage in critical solder joint. Damage growth is monitored for all cases. The study is conducted for voids of different sizes located close to the damage initiation site and propagation path. The results show that damage initiation life is a non-monotonic function of void size, peaking at a void area fraction of approx 15%. Propagation life, however, is a monotonic function of void size and decreases as voids becomes larger.
AB - This study presents simulation of damage initiation and propagation in solder joints with voids, under thermomechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the boundary conditions in a local model which focuses on the details of the critical solder ball. The local model is error-seeded with voids of different sizes and locations. A continuum cyclic creepfatigue damage model based on energy-partitioning is used as the damage ctirerion. A method of successive initiation is used to model the growth of damage in critical solder joint. Damage growth is monitored for all cases. The study is conducted for voids of different sizes located close to the damage initiation site and propagation path. The results show that damage initiation life is a non-monotonic function of void size, peaking at a void area fraction of approx 15%. Propagation life, however, is a monotonic function of void size and decreases as voids becomes larger.
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U2 - 10.1109/ESIME.2006.1644054
DO - 10.1109/ESIME.2006.1644054
M3 - Conference contribution
AN - SCOPUS:33847128882
SN - 1424402751
SN - 9781424402755
T3 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -