The successive-initiation modeling strategy for modeling damage progression: Application to voided solder interconnects

Leila Jannesari Ladani, Abhijit Dasgupta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Scopus citations

Abstract

This study presents simulation of damage initiation and propagation in solder joints with voids, under thermomechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the boundary conditions in a local model which focuses on the details of the critical solder ball. The local model is error-seeded with voids of different sizes and locations. A continuum cyclic creepfatigue damage model based on energy-partitioning is used as the damage ctirerion. A method of successive initiation is used to model the growth of damage in critical solder joint. Damage growth is monitored for all cases. The study is conducted for voids of different sizes located close to the damage initiation site and propagation path. The results show that damage initiation life is a non-monotonic function of void size, peaking at a void area fraction of approx 15%. Propagation life, however, is a monotonic function of void size and decreases as voids becomes larger.

Original languageEnglish (US)
Title of host publication7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
DOIs
StatePublished - 2006
Externally publishedYes
Event7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 - Como, Italy
Duration: Apr 24 2006Apr 26 2006

Publication series

Name7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Volume2006

Other

Other7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
CountryItaly
CityComo
Period4/24/064/26/06

ASJC Scopus subject areas

  • Engineering(all)

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