The Role of Water on the Interfacial Adhesion in Si Solar Modules

Nicholas Theut, Arun Mannodi-Kanakkithodi, April M. Jeffries, Rishi E. Kumar, Guillaume Von Gastrow, David Fenning, Maria K.Y. Chan, Mariana I. Bertoni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. As water diffuses into the module, failure mechanisms like corrosion and delamination are significantly affected. In the presence of water, the interfaces between EVA and the cell, glass, and backsheet all experience losses of adhesion exposing the module to accelerated degradation. Understanding the relation between interfacial adhesion and water content inside PV modules can help mitigate detrimental power losses. Water content measurements via short wave infrared reflectometry combined with 180° peel tests were used to study and quantify the effect of water ingress and egress on adhesion. Changes in adhesion strength for different module interfaces are quantified, correlating spatial distribution of water content to adhesion for damp heat and dry heat exposed samples. After 1000 hours of damp heat exposure, decreases in adhesion strength of approximately 1 N/mm were noted for all interfaces.

Original languageEnglish (US)
Title of host publication2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2101-2103
Number of pages3
ISBN (Electronic)9781665419222
DOIs
StatePublished - Jun 20 2021
Event48th IEEE Photovoltaic Specialists Conference, PVSC 2021 - Fort Lauderdale, United States
Duration: Jun 20 2021Jun 25 2021

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Conference

Conference48th IEEE Photovoltaic Specialists Conference, PVSC 2021
Country/TerritoryUnited States
CityFort Lauderdale
Period6/20/216/25/21

Keywords

  • adhesion
  • delamination
  • peel
  • water

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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