The Relationship Between Dealloying and Transgranular Stress-Corrosion Cracking of Cu-Zn and Cu-Al Alloys

K. Sieradzki, J. S. Kim

Research output: Contribution to journalArticle

95 Scopus citations

Abstract

Single crystals of various a-phase Cu-Zn and Cu-Al alloys have been tested for dealloying and stress-corrosion cracking (SCC) in cuprous ammonia solutions. All tests were done at the equilibrium potential of a copper electrode. The dealloying tests were done by scratching coated specimens and measuring the consequent anodic current transients, and the SCC tests used a constant extension rate. The rate of dealloying increased almost discontinuously between 17 and 20 atom percent (a/o) Zn and between 11 and 16 a/o Al. These “parting limits” corresponded identically to the onset of transgranular SCC in both systems. The results support a percolation model of dealloying and a film-induced cleavage model for stress-corrosion cracking.

Original languageEnglish (US)
Pages (from-to)1635-1639
Number of pages5
JournalJournal of the Electrochemical Society
Volume134
Issue number7
DOIs
StatePublished - Jul 1987

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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