The performance of polyurethane foam at different humidity and temperature conditions for high voltage insulation

M. Argin, G. G. Karady

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The active parts of many hollow insulation systems are placed in SF 6 or N2 filled Insulating structures. The challenge with using these insulating gases initiated the replacement of them with polyurethane foam, which is frequently used in low-voltage switchgears. Rigid pour polyurethane foam is presented to serve as a high voltage insulation material. The electrical properties are studied under power frequency and lightning impulse voltage. The performance of the proposed foam is determined at different humidity and temperature conditions.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Power Engineering Society Transmission and Distribution Conference, PES TD 2005/2006
Pages1070-1075
Number of pages6
DOIs
StatePublished - Dec 1 2006
EventIEEE Power Engineering Society Transmission and Distribution Conference, PES TD 2005/2006 - Dallas, TX, United States
Duration: May 21 2006May 24 2006

Publication series

NameProceedings of the IEEE Power Engineering Society Transmission and Distribution Conference

Other

OtherIEEE Power Engineering Society Transmission and Distribution Conference, PES TD 2005/2006
CountryUnited States
CityDallas, TX
Period5/21/065/24/06

Keywords

  • Breakdown strength
  • Electrical engineering
  • High voltage insulation
  • Impulse voltage
  • Polyurethane foam

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Argin, M., & Karady, G. G. (2006). The performance of polyurethane foam at different humidity and temperature conditions for high voltage insulation. In Proceedings of the IEEE Power Engineering Society Transmission and Distribution Conference, PES TD 2005/2006 (pp. 1070-1075). [1668650] (Proceedings of the IEEE Power Engineering Society Transmission and Distribution Conference). https://doi.org/10.1109/TDC.2006.1668650