The Improvement of Adhesion Between Silicon and Polymer by Implaing H+ ions Through the Polymer into the Silicon

Terry Alford (Inventor)

Research output: Patent

Abstract

This technique can be used at various applications, which need a good adhesion between polymer and silicon. By performing the Ion-cutting process using the hydrogen implantation, a thin single crystalline silicon layer can be transferred to the polymer layer with strong adhesion and can be applied to many flexible electronics or biotechnologies that need to use plastics combined with silicon-based devices. ---taken from invention disclosure
Original languageEnglish (US)
StatePublished - Oct 30 2003

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adhesion
polymers
silicon
inventions
ions
biotechnology
implantation
plastics
hydrogen
electronics

Cite this

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