The finite-element method for modeling circuits and interconnects for electronic packaging

Anastasis C. Polycarpou, Panayiotis A. Tirkas, Constantine Balanis

Research output: Contribution to journalArticle

41 Scopus citations

Abstract

A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

Original languageEnglish (US)
Pages (from-to)1868-1874
Number of pages7
JournalIEEE Transactions on Microwave Theory and Techniques
Volume45
Issue number10 PART 2
DOIs
StatePublished - Dec 1 1997

    Fingerprint

Keywords

  • Electronic packaging
  • Finite-element method
  • Interconnects
  • Passive circuits

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this