The finite-element method for modeling circuits and interconnects for electronic packaging

Anastasis C. Polycarpou; Panayiotis A. Tirkas; Constantine Balanis

doi:10.1109/22.641784

The finite-element method for modeling circuits and interconnects for electronic packaging

Anastasis C. Polycarpou, Panayiotis A. Tirkas, Constantine Balanis

IAFSE-ECEE: Electrical Engineering

Research output: Contribution to journal › Article › peer-review

41 Scopus citations

Abstract

A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

Original language	English (US)
Pages (from-to)	1868-1874
Number of pages	7
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	45
Issue number	10 PART 2
DOIs	https://doi.org/10.1109/22.641784
State	Published - Dec 1 1997

Keywords

Electronic packaging
Finite-element method
Interconnects
Passive circuits

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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@article{16d0bb26b9254a9e8a6e5b74a108c128,

title = "The finite-element method for modeling circuits and interconnects for electronic packaging",

abstract = "A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.",

keywords = "Electronic packaging, Finite-element method, Interconnects, Passive circuits",

author = "Polycarpou, {Anastasis C.} and Tirkas, {Panayiotis A.} and Constantine Balanis",

year = "1997",

month = dec,

day = "1",

doi = "10.1109/22.641784",

language = "English (US)",

volume = "45",

pages = "1868--1874",

journal = "IEEE Transactions on Microwave Theory and Techniques",

issn = "0018-9480",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "10 PART 2",

}

TY - JOUR

T1 - The finite-element method for modeling circuits and interconnects for electronic packaging

AU - Polycarpou, Anastasis C.

AU - Tirkas, Panayiotis A.

AU - Balanis, Constantine

PY - 1997/12/1

Y1 - 1997/12/1

N2 - A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

AB - A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

KW - Electronic packaging

KW - Finite-element method

KW - Interconnects

KW - Passive circuits

UR - http://www.scopus.com/inward/record.url?scp=0031249224&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031249224&partnerID=8YFLogxK

U2 - 10.1109/22.641784

DO - 10.1109/22.641784

M3 - Article

AN - SCOPUS:0031249224

VL - 45

SP - 1868

EP - 1874

JO - IEEE Transactions on Microwave Theory and Techniques

JF - IEEE Transactions on Microwave Theory and Techniques

SN - 0018-9480

IS - 10 PART 2

ER -