TY - JOUR
T1 - The finite-element method for modeling circuits and interconnects for electronic packaging
AU - Polycarpou, Anastasis C.
AU - Tirkas, Panayiotis A.
AU - Balanis, Constantine
N1 - Funding Information:
Manuscript received January 20, 1997; revised July 1, 1997. This work was supported by the U.S. Army Research Office under Grant DAAL03-92-G-0262.
PY - 1997
Y1 - 1997
N2 - A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.
AB - A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.
KW - Electronic packaging
KW - Finite-element method
KW - Interconnects
KW - Passive circuits
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U2 - 10.1109/22.641784
DO - 10.1109/22.641784
M3 - Article
AN - SCOPUS:0031249224
VL - 45
SP - 1868
EP - 1874
JO - IRE Transactions on Microwave Theory and Techniques
JF - IRE Transactions on Microwave Theory and Techniques
SN - 0018-9480
IS - 10 PART 2
ER -