Abstract

The anisotropy of the micromechanical behavior of single-crystal Cu 6Sn5 was studied by nanoindentation and microcompression testing of pillars. Electron backscattered diffraction was employed to determine the crystallographic orientation and texture of Cu6Sn5 nodules. Characterization results from orientation imaging mapping show that the growth direction of the nodules is somewhat aligned to the c-axis of the unit cell of Cu6Sn5, although a fair amount of deviation exists in several grains. Normal to the growth axis the orientation is random, indicating a fiber texture. The mechanical properties indicate a 20% increase in strength and 7% increase in Young's modulus close to the c-axis relative to normal to the c-axis. Careful analysis of the results based on angle to the c-axis shows a linear decrease in strength with increasing deviation from the c-axis. Our results should help understanding and fracture modeling of Cu 6Sn5 under thermal and mechanical loading conditions.

Original languageEnglish (US)
Pages (from-to)2083-2088
Number of pages6
JournalJournal of Electronic Materials
Volume41
Issue number8
DOIs
StatePublished - Aug 2012

Fingerprint

Compression testing
Textures
Nanoindentation
Electron diffraction
Anisotropy
Elastic moduli
nodules
Single crystals
Imaging techniques
Mechanical properties
Fibers
Testing
textures
deviation
nanoindentation
modulus of elasticity
electron diffraction
mechanical properties
anisotropy
fibers

Keywords

  • Crystallographic orientation
  • CuSn
  • focused ion beam
  • micropillar compression

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

@article{6d42d08f08ef4a45b0822452ae2c7b2d,
title = "The effect of crystallographic orientation on the mechanical behavior of Cu6Sn5 by micropillar compression testing",
abstract = "The anisotropy of the micromechanical behavior of single-crystal Cu 6Sn5 was studied by nanoindentation and microcompression testing of pillars. Electron backscattered diffraction was employed to determine the crystallographic orientation and texture of Cu6Sn5 nodules. Characterization results from orientation imaging mapping show that the growth direction of the nodules is somewhat aligned to the c-axis of the unit cell of Cu6Sn5, although a fair amount of deviation exists in several grains. Normal to the growth axis the orientation is random, indicating a fiber texture. The mechanical properties indicate a 20{\%} increase in strength and 7{\%} increase in Young's modulus close to the c-axis relative to normal to the c-axis. Careful analysis of the results based on angle to the c-axis shows a linear decrease in strength with increasing deviation from the c-axis. Our results should help understanding and fracture modeling of Cu 6Sn5 under thermal and mechanical loading conditions.",
keywords = "Crystallographic orientation, CuSn, focused ion beam, micropillar compression",
author = "Ling Jiang and Hanqing Jiang and Nikhilesh Chawla",
year = "2012",
month = "8",
doi = "10.1007/s11664-012-2124-4",
language = "English (US)",
volume = "41",
pages = "2083--2088",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "8",

}

TY - JOUR

T1 - The effect of crystallographic orientation on the mechanical behavior of Cu6Sn5 by micropillar compression testing

AU - Jiang, Ling

AU - Jiang, Hanqing

AU - Chawla, Nikhilesh

PY - 2012/8

Y1 - 2012/8

N2 - The anisotropy of the micromechanical behavior of single-crystal Cu 6Sn5 was studied by nanoindentation and microcompression testing of pillars. Electron backscattered diffraction was employed to determine the crystallographic orientation and texture of Cu6Sn5 nodules. Characterization results from orientation imaging mapping show that the growth direction of the nodules is somewhat aligned to the c-axis of the unit cell of Cu6Sn5, although a fair amount of deviation exists in several grains. Normal to the growth axis the orientation is random, indicating a fiber texture. The mechanical properties indicate a 20% increase in strength and 7% increase in Young's modulus close to the c-axis relative to normal to the c-axis. Careful analysis of the results based on angle to the c-axis shows a linear decrease in strength with increasing deviation from the c-axis. Our results should help understanding and fracture modeling of Cu 6Sn5 under thermal and mechanical loading conditions.

AB - The anisotropy of the micromechanical behavior of single-crystal Cu 6Sn5 was studied by nanoindentation and microcompression testing of pillars. Electron backscattered diffraction was employed to determine the crystallographic orientation and texture of Cu6Sn5 nodules. Characterization results from orientation imaging mapping show that the growth direction of the nodules is somewhat aligned to the c-axis of the unit cell of Cu6Sn5, although a fair amount of deviation exists in several grains. Normal to the growth axis the orientation is random, indicating a fiber texture. The mechanical properties indicate a 20% increase in strength and 7% increase in Young's modulus close to the c-axis relative to normal to the c-axis. Careful analysis of the results based on angle to the c-axis shows a linear decrease in strength with increasing deviation from the c-axis. Our results should help understanding and fracture modeling of Cu 6Sn5 under thermal and mechanical loading conditions.

KW - Crystallographic orientation

KW - CuSn

KW - focused ion beam

KW - micropillar compression

UR - http://www.scopus.com/inward/record.url?scp=84874481529&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84874481529&partnerID=8YFLogxK

U2 - 10.1007/s11664-012-2124-4

DO - 10.1007/s11664-012-2124-4

M3 - Article

AN - SCOPUS:84874481529

VL - 41

SP - 2083

EP - 2088

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 8

ER -