TY - JOUR
T1 - The Development of an All-polymer-based Piezoelectric Photocurable Resin for Additive Manufacturing
AU - Chen, Xiangfan
AU - Ware, Henry Oliver T.
AU - Baker, Evan
AU - Chu, Weishen
AU - Hu, Jianmin
AU - Sun, Cheng
N1 - Funding Information:
This work is supported by the National Science Foundation (NSF) under Grant number EEC-1530734 and DBI-1353952. The work used the Northwestern University Micro/Nano Fabrication Facility (NUFAB), which is supported by the State of Illinois and Northwestern University.
Publisher Copyright:
© 2016 Published by Elsevier B.V.
PY - 2017
Y1 - 2017
N2 - In this work, we report the development of an all-polymer-based piezoelectric photocurable resin (V-Ink) suitable for additive manufacturing processes based on light-controlled polymerization techniques. By taking into account the trade off between the manufacturability and piezoelectric characteristics, the optimized V-Ink contains 35 wt.% of polyvinylidene fluoride (PVDF) particles being suspended in the photocurable resin. We have successfully demonstrated a 3D printed piezoelectrically-active thick film with an optimized piezoelectric voltage coefficient (g33) of 105.12 × 10-3 V·m/N. We envision this new materials will bring promising opportunities for additive manufacturing of flexible functional devices, especially for novel applications in biosensing and detection.
AB - In this work, we report the development of an all-polymer-based piezoelectric photocurable resin (V-Ink) suitable for additive manufacturing processes based on light-controlled polymerization techniques. By taking into account the trade off between the manufacturability and piezoelectric characteristics, the optimized V-Ink contains 35 wt.% of polyvinylidene fluoride (PVDF) particles being suspended in the photocurable resin. We have successfully demonstrated a 3D printed piezoelectrically-active thick film with an optimized piezoelectric voltage coefficient (g33) of 105.12 × 10-3 V·m/N. We envision this new materials will bring promising opportunities for additive manufacturing of flexible functional devices, especially for novel applications in biosensing and detection.
KW - additive manufacturing
KW - all-polymer-based
KW - piezoelectric photocurable resin
KW - projection stereolithography
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U2 - 10.1016/j.procir.2017.04.025
DO - 10.1016/j.procir.2017.04.025
M3 - Conference article
AN - SCOPUS:85029711254
SN - 2212-8271
VL - 65
SP - 157
EP - 162
JO - Procedia CIRP
JF - Procedia CIRP
T2 - 3rd CIRP Conference on BioManufacturing 2017
Y2 - 11 July 2017 through 14 July 2017
ER -