Abstract

This work focuses on mitigating the damage from nanostructure fabrication using silica nanosphere lithography (SNL) and metal assisted chemical etching (MACE). Metal contamination and plasma damage are the two main factors to limit the Si wafer's minority carrier lifetime. Ni/Au and Ti/Au metal layers on bare Si wafer are compared using lifetime recovery test. Ti/Au shows to be more suitable for the MACE process. Samples deposited with Ni/Au and Ti/Au show lifetimes of 7 \mu \mathrm{s} and 1200 \mu \mathrm{s}, respectively. The silicon surfaceis degraded significantly by the RIE plasma during the nanosphere etching process. SiO2 protective layer was added to the process, mitigating significantly the plasma damage on the siliconsurface. Lifetime measurements shows an improvement over 1 ms when SiO2 protective layer on planar Si wafer is used. Lifetimes of 353 \mu \mathrm{s} and implied open circuit voltages of 651mV were accomplished on nanopillar structured wafers using SiOx protective layer and Ti/Au.

Original languageEnglish (US)
Title of host publication2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3121-3124
Number of pages4
ISBN (Electronic)9781538685297
DOIs
StatePublished - Nov 26 2018
Event7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States
Duration: Jun 10 2018Jun 15 2018

Other

Other7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
CountryUnited States
CityWaikoloa Village
Period6/10/186/15/18

Fingerprint

Nanospheres
Silicon Dioxide
Lithography
Etching
Metals
Silica
Plasmas
Carrier lifetime
Reactive ion etching
Silicon
Open circuit voltage
Nanostructures
Contamination
Fabrication
Recovery

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kim, S., Dahal, S., Augusto, A., Bowden, S., & Honsberg, C. (2018). The damage mitigation process for Si nanopillar structure using silica nanosphere lithography and metal assisted chemical etching. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC (pp. 3121-3124). [8548297] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2018.8548297

The damage mitigation process for Si nanopillar structure using silica nanosphere lithography and metal assisted chemical etching. / Kim, Sangpyeong; Dahal, Som; Augusto, Andre; Bowden, Stuart; Honsberg, Christiana.

2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. p. 3121-3124 8548297.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, S, Dahal, S, Augusto, A, Bowden, S & Honsberg, C 2018, The damage mitigation process for Si nanopillar structure using silica nanosphere lithography and metal assisted chemical etching. in 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC., 8548297, Institute of Electrical and Electronics Engineers Inc., pp. 3121-3124, 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018, Waikoloa Village, United States, 6/10/18. https://doi.org/10.1109/PVSC.2018.8548297
Kim S, Dahal S, Augusto A, Bowden S, Honsberg C. The damage mitigation process for Si nanopillar structure using silica nanosphere lithography and metal assisted chemical etching. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc. 2018. p. 3121-3124. 8548297 https://doi.org/10.1109/PVSC.2018.8548297
Kim, Sangpyeong ; Dahal, Som ; Augusto, Andre ; Bowden, Stuart ; Honsberg, Christiana. / The damage mitigation process for Si nanopillar structure using silica nanosphere lithography and metal assisted chemical etching. 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 3121-3124
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