Abstract
The Flexible Display Center (FDC) at Arizona State University has created comprehensive capability in backplane design, fabrication, assembly, test and evaluation to enable rapid cycles of learning and development Inflexible thin film transistor (TFT) backplane technology. FDC backplanes are integrated with partners' frontplane technologies to produce high performance active matrix (AM) reflective electrophoretic ink and cholesteric liquid crystal and emissive OLED flexible display technology demonstrators (TDs). We fabricate backplanes on a 6" wafer-scale Pilot Line linked to a Manufacturing Execution System and supported by a comprehensive suite of in-Fab metrology tools. We are installing a GENII (370 × 470 mm) display-scale Pilot Line, with qualified operation slated for 2006. This paper overviews the critical steps in our backplane technology evolution, from qualification of our baseline low temperature a-Si process on the 6" line with rigid substrates, to transferring the process to flexible plastic substrates, to form factor scale-up of the TFT arrays, and finally Pilot Line scale-up to GEN II.
Original language | English (US) |
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Title of host publication | SID Conference Record of the International Display Research Conference |
Pages | 17-20 |
Number of pages | 4 |
State | Published - 2006 |
Event | SID 26th International Display Research Conference - Kent, OH, United States Duration: Sep 18 2006 → Sep 21 2006 |
Other
Other | SID 26th International Display Research Conference |
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Country/Territory | United States |
City | Kent, OH |
Period | 9/18/06 → 9/21/06 |
Keywords
- Backplane electronics
- Cholesteric liquid crystal
- Electrophoretic ink
- Flexible displays
- OLEDs
- Thin Film Transistors (TFTs)
ASJC Scopus subject areas
- Engineering(all)