Test structures for analyzing the mechanisms of wafer chemical contaminant removal

J. Yan; Hugh Barnaby; B. Vermiere; T. Peterson; F. Shadman

Test structures for analyzing the mechanisms of wafer chemical contaminant removal

J. Yan, Hugh Barnaby, B. Vermiere, T. Peterson, F. Shadman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The design of an electrochemical sensor to measure wafer contaminant concentrations during ultrapure water rinses is discussed in the article. The techniques discussed in this paper also demonstrate the need to have additional monitor devices on-chip that enable the characterization of unwanted parasitic devices. The results obtained from the experiments conducted will provide, for the first time, data on the removal rates of contaminants from deep trenches, thereby enabling the identification of mechanisms and the development of models for wafer contaminant removal in advance semiconductor processes.

Original language	English (US)
Title of host publication	IEEE International Conference on Microelectronic Test Structures
Pages	209-213
Number of pages	5
State	Published - 2003
Externally published	Yes
Event	IEEE International Conference on Microelectronic Test Structures - Monterey, CA, United States Duration: Mar 17 2003 → Mar 20 2003

Other

Other	IEEE International Conference on Microelectronic Test Structures
Country/Territory	United States
City	Monterey, CA
Period	3/17/03 → 3/20/03

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@inproceedings{3cb1cdf8a862441f8b3d1711b56d4df4,

title = "Test structures for analyzing the mechanisms of wafer chemical contaminant removal",

abstract = "The design of an electrochemical sensor to measure wafer contaminant concentrations during ultrapure water rinses is discussed in the article. The techniques discussed in this paper also demonstrate the need to have additional monitor devices on-chip that enable the characterization of unwanted parasitic devices. The results obtained from the experiments conducted will provide, for the first time, data on the removal rates of contaminants from deep trenches, thereby enabling the identification of mechanisms and the development of models for wafer contaminant removal in advance semiconductor processes.",

author = "J. Yan and Hugh Barnaby and B. Vermiere and T. Peterson and F. Shadman",

year = "2003",

language = "English (US)",

pages = "209--213",

booktitle = "IEEE International Conference on Microelectronic Test Structures",

note = "IEEE International Conference on Microelectronic Test Structures ; Conference date: 17-03-2003 Through 20-03-2003",

}

TY - GEN

T1 - Test structures for analyzing the mechanisms of wafer chemical contaminant removal

AU - Yan, J.

AU - Barnaby, Hugh

AU - Vermiere, B.

AU - Peterson, T.

AU - Shadman, F.

PY - 2003

Y1 - 2003

N2 - The design of an electrochemical sensor to measure wafer contaminant concentrations during ultrapure water rinses is discussed in the article. The techniques discussed in this paper also demonstrate the need to have additional monitor devices on-chip that enable the characterization of unwanted parasitic devices. The results obtained from the experiments conducted will provide, for the first time, data on the removal rates of contaminants from deep trenches, thereby enabling the identification of mechanisms and the development of models for wafer contaminant removal in advance semiconductor processes.

AB - The design of an electrochemical sensor to measure wafer contaminant concentrations during ultrapure water rinses is discussed in the article. The techniques discussed in this paper also demonstrate the need to have additional monitor devices on-chip that enable the characterization of unwanted parasitic devices. The results obtained from the experiments conducted will provide, for the first time, data on the removal rates of contaminants from deep trenches, thereby enabling the identification of mechanisms and the development of models for wafer contaminant removal in advance semiconductor processes.

UR - http://www.scopus.com/inward/record.url?scp=0038303495&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038303495&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0038303495

SP - 209

EP - 213

BT - IEEE International Conference on Microelectronic Test Structures

T2 - IEEE International Conference on Microelectronic Test Structures

Y2 - 17 March 2003 through 20 March 2003

ER -

Test structures for analyzing the mechanisms of wafer chemical contaminant removal

Abstract

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this