Terahertz micromachined on-wafer probes: Repeatability and reliability

Lihan Chen, Chunhu Zhang, Theodore J. Reck, Alex Arsenovic, Matthew Bauwens, Christopher Groppi, Arthur W. Lichtenberger, Robert M. Weikle, N. Scott Barker

Research output: Contribution to journalArticle

20 Scopus citations

Abstract

An improved micromachined on-wafer probe covering frequencies 500-750 GHz is demonstrated in this paper to address sub-millimeter-wave integrated-circuit testing. Measurements of a prototype WR-1.5 micromachined on-wafer probe exhibit a return loss better than 12 dB and a mean insertion loss of 6.5 dB from 500 to 750 GHz. The repeatability of on-wafer measurements with the micromachined probe is investigated. Monte Carlo simulations are used to identify the dominant error source of on-wafer measurement and to estimate the measurement accuracy. The dominant error source is positioning error, which results in phase uncertainty. Reliability tests show the probe is robust and can sustain over 20000 contacts.

Original languageEnglish (US)
Article number6230621
Pages (from-to)2894-2902
Number of pages9
JournalIEEE Transactions on Microwave Theory and Techniques
Volume60
Issue number9
DOIs
StatePublished - Jul 9 2012

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Keywords

  • Micromachined
  • on-wafer probe
  • reliability
  • terahertz

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Chen, L., Zhang, C., Reck, T. J., Arsenovic, A., Bauwens, M., Groppi, C., Lichtenberger, A. W., Weikle, R. M., & Barker, N. S. (2012). Terahertz micromachined on-wafer probes: Repeatability and reliability. IEEE Transactions on Microwave Theory and Techniques, 60(9), 2894-2902. [6230621]. https://doi.org/10.1109/TMTT.2012.2205016