Abstract
Transmission electron microscopy (TEM) in both cross sectional and plan view is used to study the effect of annealing Ag-Ti bilayers deposited on SiO 2/Si substrates in an NH 3 ambient. The resulting structure, texture and grain size are investigated. Comparisons are made between films annealed at 400, 500 and 600 °C. Silver films show increasingly strong 〈111〉 texture with annealing temperature while exhibiting a bamboo-like grain structure at 600 °C. Considerable grain growth with lateral grain sizes of up to 5 times the thickness of the Ag film is observed at 600 °C. The grains typically extend through the Ag film thickness. The Ti/SiO 2 interface uniformity and the absence of voids at the substrate surface are positive indicators of the role of titanium as a good adhesion promoter. At 600 °C, a uniform TiN encapsulation layer is observed on the Ag surface.
Original language | English (US) |
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Title of host publication | Materials Research Society Symposium - Proceedings |
Publisher | MRS |
Pages | 197-202 |
Number of pages | 6 |
Volume | 472 |
State | Published - 1997 |
Event | Proceedings of the 1997 MRS Spring Symposium - San Francisco, CA, USA Duration: Apr 1 1997 → Apr 4 1997 |
Other
Other | Proceedings of the 1997 MRS Spring Symposium |
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City | San Francisco, CA, USA |
Period | 4/1/97 → 4/4/97 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials