Abstract
The paper introduces the problem of system-level thermal aware design of applications with uncertain run time on an embedded processor equipped with dynamic voltage/frequency scaling features. The problem takes as inputs a task sequence, cycle time distribution of each task, and processor thermal model. The solution specifies a voltage/frequency assignment to the tasks such that the expected latency is minimized subject to the probability that the peak temperature constraint is not violated is no less than a designer specified value. We prove that the problem is at least NP-hard, and present optimal and (1 + ε) fully polynomial time approximation scheme as solutions. To the best of our knowledge, this paper is the first work that addresses the stochastic version of the system-level thermal-aware design problem. We evaluate the effectiveness of our techniques by experimenting with realistic and synthetic benchmarks.
| Original language | English (US) |
|---|---|
| Title of host publication | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD |
| Pages | 242-249 |
| Number of pages | 8 |
| DOIs | |
| State | Published - 2008 |
| Event | 2008 International Conference on Computer-Aided Design, ICCAD - San Jose, CA, United States Duration: Nov 10 2008 → Nov 13 2008 |
Other
| Other | 2008 International Conference on Computer-Aided Design, ICCAD |
|---|---|
| Country | United States |
| City | San Jose, CA |
| Period | 11/10/08 → 11/13/08 |
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ASJC Scopus subject areas
- Computer Graphics and Computer-Aided Design
- Computer Science Applications
- Software
Cite this
System-level thermal aware design of applications with uncertain execution time. / Zhang, Sushu; Chatha, Karam S.
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. 2008. p. 242-249 4681581.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - System-level thermal aware design of applications with uncertain execution time
AU - Zhang, Sushu
AU - Chatha, Karam S.
PY - 2008
Y1 - 2008
N2 - The paper introduces the problem of system-level thermal aware design of applications with uncertain run time on an embedded processor equipped with dynamic voltage/frequency scaling features. The problem takes as inputs a task sequence, cycle time distribution of each task, and processor thermal model. The solution specifies a voltage/frequency assignment to the tasks such that the expected latency is minimized subject to the probability that the peak temperature constraint is not violated is no less than a designer specified value. We prove that the problem is at least NP-hard, and present optimal and (1 + ε) fully polynomial time approximation scheme as solutions. To the best of our knowledge, this paper is the first work that addresses the stochastic version of the system-level thermal-aware design problem. We evaluate the effectiveness of our techniques by experimenting with realistic and synthetic benchmarks.
AB - The paper introduces the problem of system-level thermal aware design of applications with uncertain run time on an embedded processor equipped with dynamic voltage/frequency scaling features. The problem takes as inputs a task sequence, cycle time distribution of each task, and processor thermal model. The solution specifies a voltage/frequency assignment to the tasks such that the expected latency is minimized subject to the probability that the peak temperature constraint is not violated is no less than a designer specified value. We prove that the problem is at least NP-hard, and present optimal and (1 + ε) fully polynomial time approximation scheme as solutions. To the best of our knowledge, this paper is the first work that addresses the stochastic version of the system-level thermal-aware design problem. We evaluate the effectiveness of our techniques by experimenting with realistic and synthetic benchmarks.
UR - http://www.scopus.com/inward/record.url?scp=57849150386&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=57849150386&partnerID=8YFLogxK
U2 - 10.1109/ICCAD.2008.4681581
DO - 10.1109/ICCAD.2008.4681581
M3 - Conference contribution
AN - SCOPUS:57849150386
SN - 9781424428205
SP - 242
EP - 249
BT - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ER -