We report the synthesis of Ge1-ySny films containing 6%-13% Sn directly on Si(100) for monolithic integration applications, circumventing the use of conventional Ge-buffer layers. The films are produced in a gas source molecular epitaxy chamber at ultralow temperatures of 185-210 °C and a pressure of 10-5 Torr by the reactions of pure vapor Ge4H10 and SnD4 or SnH4 without carrier gases. Very small amounts of Si, incorporated via the Si4H10 precursor, can be used to improve the structural properties. All samples were characterized by XRD, RBS, IR-ellipsometry, AFM, and TEM, indicating the formation of monocrystalline single-phase films with relatively low defectivity and flat surfaces. A notable highlight is that the residual strains of the alloy layers are much lower compared to those grown on Ge buffers and can be further reduced by rapid thermal annealing without decomposition, indicating that growth on bare silicon should produce bulklike, high Sn content alloys that cannot be accessed using Ge buffers. N-type analogs of the above samples doped with phosphorus were also produced using P(SiH3)3 as the in situ dopant precursor. The results collectively illustrate the potential of our chemistry-based method to generate good quality Ge1-ySny layers directly on large area Si wafers bypassing Ge buffers that typically lead to complications such as multiple hetero-interfaces and epitaxial breakdown at high Sn concentrations.
|Original language||English (US)|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|State||Published - Dec 1 2022|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films