Study of dopant activation in biaxially compressively strained SiGe layers using excimer laser annealing

G. V. Luong, S. Wirths, S. Stefanov, B. Holländer, J. Schubert, J. C. Conde, T. Stoica, U. Breuer, S. Chiussi, Michael Goryll, D. Buca, S. Mantl

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

Excimer Laser Annealing (ELA) with a wavelength of 248 nm is used to study doping of biaxialy compressively strained Si1-xGex/Si heterostructures. The challenge is to achieve a high activation of As in SiGe, while conserving the elastic strain and suppressing dopant diffusion. Doping of 20 nm Si0.64Ge0.36 layers by ion implantation of 1 × 1015 As+/cm2 and subsequent laser annealing using single 20 ns pulse with an energy density of 0.6 J/cm2 leads to an As activation of about 20% and a sheet resistance of 650 Ω/sq. At this laser energy density, the entire SiGe layer melts and the subsequent fast recrystallization on a nanosecond time scale allows high As incorporation into the lattice. Moreover, using these annealing parameters, the SiGe layer exhibits epitaxial regrowth with negligible strain relaxation. ELA at energy densities greater than 0.6 J/cm2 resembles Pulsed Lased Induced Epitaxy, leading to an intermixing of the SiGe layer with the Si substrate, thus to thicker single-crystalline strained SiGe layers with sheet resistance down to 62 Ω/sq. Effects of energy densities on composition, crystal quality, activation of As and co-doping with B are discussed and related to the spatial and temporal evolution of the temperature in the irradiated zone, as simulated by Finite Element Methods.

Original languageEnglish (US)
Article number204902
JournalJournal of Applied Physics
Volume113
Issue number20
DOIs
StatePublished - May 28 2013

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Study of dopant activation in biaxially compressively strained SiGe layers using excimer laser annealing'. Together they form a unique fingerprint.

Cite this